The programming of SMT machine includes the operation of each process in the process of SMT, such as the arrangement of SMT Feeder, the order of picking up material and the order of SMD, etc. All these should be arranged in the order when the SMT machine is programmed. NeoDen to share what are the programming parameters for the operation of SMD machine programming.
I. SMT placement program settings
SMD program setting refers to the environment setting of the SMD program, such as the machine configuration, coordinate reference origin, the selection of component database and the selection of feeder database.
1. The machine configuration is the basic setting environment of the SMD program. The configuration of SMT machine includes: the type of pick and place machine head. the position, type and accuracy of the camera. the parameters of the circuit board transmission. the type and number of nozzles stored in the machine. the parameters of the automatic tray feeder. the parameters of each axis of the machine. and other parameters.
2. The coordinate reference origin is the gap between the coordinate origin of the circuit board and the coordinate origin of the chip component. Different equipment coordinate system direction is different, when the coordinate origin of the circuit board in the corner of the circuit board, and the chip component coordinates to the same direction of the corner of the board or a base point as the origin.
3. Component database: some machines can be set up according to different product series and storage of multiple component database, you can call a different database when needed.
4. Feeder database has such as component database, can also store multiple feeder database, according to the need to choose.
II. The circuit board specifications
refers to the size of the circuit board and the way to put together the board, the bonder needs to adjust the width of the circuit board conveyor track and transmission distance according to the size of the circuit board, the support device of the circuit board can also be adjusted according to the thickness of the circuit board to support the height. The general products of the circuit board using a single product; some products due to the size of a single circuit board is too small, not conducive to the production of placement equipment, or in order to improve the production efficiency of equipment, reduce the transmission time of the circuit board, so the use of multiple products to put together the board way. For more than one product splicing board, in the component placement list input, only need to input a splicing board components, other splicing board components position can automatically copy.
III. Circuit board offset correction
It refers to using the reference point of the circuit board to carry out the correction of the SMD coordinate. The reference point is some characteristic point on the circuit board, generally it is produced at the same time of the production of the circuit board by using the same process as the printed line and the metal pad of the component, it can provide the fixed and accurate position, it is the characteristic point which is used to carry out the overall correction of the placement position of the component. The calibration way of the reference point on the line board can be divided into 3 kinds: Use the comprehensive calibration reference point to carry out the whole board calibration Global Correction to all the components on the line board; Use the reference point on the collocation board to carry out the calibration Circuit Correction to the components on the collocation board and its offset board; Use the reference point beside the components to carry out the calibration to the local single high-precision components. The use of components next to the reference point for local single high-precision components for correction.
IV. The configuration of pick and place machine nozzle
The mounting machine program can be optimized according to the nozzles stored in the existing machine or not limited nozzles for the mounting sequence. If it is optimized according to the nozzle stored in the existing machine, then the nozzle does not need to be reconfigured; if it is optimized without limited nozzle, then the nozzle needs to be reconfigured according to the nozzle list generated after the optimization.
V. The product component mount list
The mounting list includes the component's bit number Ref ID, material code Component ID, X coordinate, y coordinate and mounting angle Theta, etc. This is the key data required for surface mounting, which determines the exact position of component mounting on the circuit board. The material code is connected to the component data base, and after the nozzle on the mounting head picks up the component at the specific position of the feeder, the component is accurately mounted at the specified position on the circuit board by photographing and identifying the component, according to the coordinates and angle of the mounted component, etc., plus the deviation of the component pickup obtained through correction.
The order of component placement is the order of component placement, for the turret type mounter, the order of component pickup and the order of component placement are the same; and for the platform type mounter, if there are multiple nozzles on the mount head, the order of component pickup and the order of placement can be different. Because of the development of the computer application, now all kinds of mounter's mount order can be optimized automatically, also some general software can carry on the automatic optimization to all kinds of different mounter's mount order. Chip components can be generally classified into different types such as Chip, Melf, QFP, SOlO, PLCC, SOJ, SOT and BGA.
The component database contains the length, width and thickness of the components, the dimensions of the component features, the span and the packaging of the components. In addition, for different machines, the component database includes the type of placement head and nozzle, the light intensity of the identification camera, the type and orientation of the default feeder for the component, and the identification method and special requirements. All the data contained in the component database will be critical for component feeding, picking, identification, calibration and placement.
VI. SMT machine feeder list
When a new component is added to the component placement list, the component is automatically added to the feeder list based on the default feeder type in the component database. The feeder list includes the component code for each component, the type of feeder used, the identification code for the location and the correct orientation of the component on the feeder. If an individual component does not pass in the identification, the component is thrown away according to the component database or the programmed throw station settings.
