In the SMT machine printing processing, the processed electronic products need to be inspected. What are the main points of inspection?
Please see below:
1. Pick and place machine printing process quality requirements
(1) tin slurry position in the center, no obvious deviation, can not affect the paste and solder;
(2) printing tin paste moderate, can be good paste, no less tin, tin paste too much;
(3) tin slurry point forming good, should not even tin, bumpy.
2. Components mount process quality requirements
(1) The components shall be mounted neatly and in the center without deviation or skew;
(2) The model and specification of the components in the mounting position should be correct; The components shall be free of omissions and mis-stickers;
(3) The patch components are not allowed to have reverse paste;
(4) the installation of the patch device with polarity requirements should be installed according to the correct polarity mark;
(5) The components shall be mounted neatly and in the center without deviation or skew.
3. Welding process requirements for components
(1) the FPC board should be free of solder paste and foreign bodies and stains that affect the appearance;
(2) The bonding position of the components should have no influence on the appearance of rosin or solder flux and foreign matter;
(3) The tin point below the component is well formed, without abnormal wire drawing or pointed drawing
4. Appearance process requirements of components
(1) plate bottom, plate surface, copper foil, line, through hole, etc., should have no crack or cut off, no short circuit caused by poor cutting phenomenon;
(2) FPC board is parallel to the plane, the board has no convex deformation;
(3) FPC board should have no leakage V/V bias phenomenon;
(4) Marking information character silkscreen printing text without blur, offset, reverse, offset, double, etc.;
(5) the outer surface of the FPC board should have no expansion and bubbling phenomenon;
(6) the aperture size requirements meet the design requirements.
