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NeoDen YS350 Semi Automatic Screen Printer

NeoDen YS350 Semi Automatic Screen Printer

■ Semi Auto Printer
■ 400 mm * 240 mm Max PCB size
■ 0.2 mm ~ 2.0 mm PCB thickness
■ 500 * 320 mm Printing area
NeoDen YS350 Semi automatic screen printer is used for PCB screen printing with high precision and flexibility.
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Product Details ofNeoDen YS350 Semi Automatic Screen Printer

Description

Control System

Microcomputer Control  Touch Screen Display Menu User Interface

Touch Screen Interface

Time Display Function Automatic Counting Function of Printing Times 

Scrapers

Similar to the full automatic printing machine, the scraper can freely move up and down The pressure of scarpering is adjustable according to a different model of the scraper.The stopping time of scraper at the position of upper left/right and lower left/right can be set independentlyThe speed of the scrapers can be adjusted Emergency stop of the scrapers to keep the safety.

Stencil

Similar to the full automatic printing machine, the stencil will rise slowly within 2 seconds to demould then quickly rise to leave the PCB, which avoids the wire drawing occurring in the demouldand saves time and improves production efficiency.

Positioning of PCB

Reference holes positioningReference edge positioning

 

Specification

Product nameSemi automatic screen printerPCB thickness0.2-2.0mm
PCB size mix400*240mmAir source4-6kg/cm2
Printing area500*320mmPower supplyAC220V 50HZ
Frame sizeL(550-650)*W(370-470)mmDimensionL 800*W 700*H 1700 (mm)
Printing/repeating accuracy+/-0.2mmPacking size1050*900*1850(mm)
N.W./G.W.230/280 Kg  

 

Quality Control

We have QC person stay on the production lines do to the inspection.All products must have been inspected before delivery. We do inline inspection and final inspection.1. All raw material checked once it arrive our factory.2. All pieces and logo and all details checked during production.3. All packing details checked during production.4. All production quality and packing checked on final inspection after finished.

 

 
Provide one-stop SMT assembly production line
 

SMT production line

If any PCB assembly production line required, SMT PCB printer Semi-auto solder printer+ pick and place machine+ smt conveyor+ reflow soldering oven can be supplied.

 

About us

 
Factory
 
neoden factory
neoden factory
neoden factory

 

 
Certification
 

Certification NeoDen

 

 
Exhibition
 
SMT machine exhibition
SMT machine exhibition
SMT machine exhibition
SMT machine exhibition
SMT machine exhibition
SMT machine exhibition

 

If you need, please feel free to contact us for more information.

 

 

FAQ
Q1. What causes solder paste sticking to the stencil apertures?
  • Aperture design: Tapered walls (e.g., laser-cut stencils) reduce adhesion.
  • Paste quality: Use Type 3/4 pastes with proper viscosity (e.g., 800–1,200 kcps).
  • Environment: Control humidity at 40–60% RH to prevent paste drying.

 

Q2. How can I extend the squeegee blade lifespan?
  • Material: Use polyurethane blades (60–80 Shore hardness) for durability.
  • Rotation: Flip blades every 4–8 hours to distribute wear evenly.
  • Storage: Keep blades in a dark, dry place to prevent UV/humidity degradation.

 

Q3. How to optimize solder paste release from stencil apertures?
  • Ensure stencil thickness matches component pitch (e.g., 0.1mm for 0201 components)
  • Maintain proper aperture wall geometry (laser-cut + electro-polished recommended)
  • Control printing environment at 25±2°C/50±10%RH
  • Use Type 3 or 4 solder paste with 90-95% metal content

 

Q4. What causes poor print definition (smearing/skipping)?
  • Insufficient squeegee pressure (adjust to 4-6kg force)
  • Worn squeegee blades (replace every 50,000-80,000 prints)
  • Improper stencil-PCB separation speed (0.1-0.5mm/sec)
  • Contaminated stencil underside (clean every 10-15 prints)
     
Q5. Why does solder paste height vary across the PCB?
  • Uneven stencil tension (should be >35N/cm²)
  • PCB support pins improperly positioned (use 1 pin per 100cm²)
  • Squeegee blade angle deviation (maintain 60±5°)
  • Solder paste slump (keep paste temperature <26°C)

 

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