SMD is the rapid development of electronic technology boost, first of all, the solder paste printing in PCB light board above, and then through the SMT machine to mount all kinds of electronic components to the designated pad position, and then by reflow oven high temperature hot melt welding, which is the basic process of SMD.
Electronic components crawl tin process
Usually, our circuit board is covered with all kinds of electronic components, but many people do not know how to process and become, today we will share with you in this regard.
At first, our electronic products need to play a relevant effect, must have PCB (equivalent to a building foundation). PCB inside covered with all kinds of functional communication circuit, and to play the function of electronic products, we must be in its PCB pads above all kinds of functional electronic components (such as resistors, capacitors, inductors, connectors, switches, IC, etc.), different electronic components play a different function.
To mount and fix these electronic components in the PCB above, then need SMT patch these process technology (solder paste machine printing, mount machine mount, reflow oven welding), and today's topic electronic components climb tin process is appear in reflow soldering this process.
First of all reflow soldering machine inside there are 4 temperature zones, are preheating, constant temperature, heating, cooling, preheating purpose is to let the PCB pad surface temperature of all kinds of components slowly warm up (avoid room temperature components directly into the welding high temperature zone, otherwise high temperature will likely lead to components or pcb direct damage). When the temperature rises into the thermostat zone, the purpose of the thermostat zone is to allow the temperature of the surface components to be at a basic level. Finally enter the welding zone, welding is the highest temperature (generally reached between 220-250 degrees Celsius), the alloy tin powder in the solder paste will be hot melt into a liquid state, liquid tin will follow the electronic components of the pin climbing tin, and then to the cooling zone after the gradual formation of solid tin, so as to achieve the role of fixed in the pad, so that it can make all kinds of components to play its effectiveness.
