Component weight limit on PCB underside during reflow soldering
Above is a picture detailing one method for populating a two sided surface mount PCB. We covered using a stencil to apply solder paste for a PCB a few weeks ago. In the comments there was a debate about the virtue of using stencils as well as a question about how two sided boards are populated. This was a good question because reflowing a board twice can cause components on the underside to fall off.
comment mentions that there are a couple of methods for two sided population. In the video you will see that a stencil is not being used, but instead, paste is applied by a pedal actuated syringe. The paste is applied to the underside of the board first, then a teeny dot of epoxy is added to hold the component in place. Each part is then positioned normally and baked in a reflow oven. This process both reflows the solder, and cures the epoxy. When the board is reflowed a second time, the epoxy holds the bottom components in place as the top solder reaches its melting point.
This method of applying solder paste is slower than using a stencil. But if done correctly, every component can get the amount of solder needed.
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