SMT Reflow soldering process is the most widely used method of attaching surface mount components(SMC) to printed circuit boards (PCBs). The aim of the process is to form acceptable solder joints between SMC and PCB. The reflow soldering process normally adopt following steps:
Solder paste is a kind mixture of solder alloy and flux. For reflow soldering normally adopt SnAgCu(Sn 99%, Ag 0.3%, Cu 0.7%) alloy,Make the SnAgCu to the small balls(1#?2#:75-150um?3#:25-45um,4#:20-38um?5#:10-20um) and mixed it with the flux?surface active agent and other things that can be helpful for soldering.
There are three method to print the solder paste on PCB, Manually, use semi auto solder printer or use the full automatic online solder paste printer. If use the full automatic smt stencil printer, then it need a PCB loader to send the PCB to it automaticly.
NeoDen provide a full smt assembly line solutions, including SMT reflow oven, wave soldering machine, pick and place machine, solder paste printer, PCB loader, PCB unloader, chip mounter, SMT AOI machine, SMT SPI machine, SMT X-Ray machine, SMT assembly line equipment, PCB production Equipment smt spare parts etc any kind SMT machines you may need, please contact us for more information:
Hangzhou NeoDen Technology Co.,Ltd
Add: Building 3,Diaoyu Industrial and Technology Park,No.8-2,Keji Avenue, Yuhang District, Hangzhou，China
Contact us: Steven Xiao
Phone: 86-18167133317
Fax: 86-571-26266866
Skype：toner_cartridge
E-mail: steven@neodentech.com
E-mail: info@neodentech.com