SMT is the upstream industry of electronics industry, commonly known as surface mount technology. Electronic products or large or small motherboards are involved in a variety of components, and all kinds of components are realized through SMT technology. In the SMT industry, there are many testing procedures and related equipment. Today, we will talk about THE SMT optical detector, which is SMT AOI, X-ray and ICT.
AOI Machine
AOI is a equipment based on optical principles to detect common defects encountered in reflow oven welding production. It uses high-speed and high-precision visual processing technology to automatically detect various mounting errors and welding defects on PCB boards. Good process control is achieved by using AOI as a defect reduction tool to find and eliminate errors early in the assembly process. Early detection of defects will avoid sending broken boards to later assembly stages, and AOI will reduce repair costs and avoid discarding unrepairable boards.
X-RAY
X-ray has strong penetration, and its perspective can show the thickness, shape and mass density distribution of the solder joint, which can fully reflect the welding quality of the solder joint, such as open circuit, short circuit, hole, bubble inside the hole and tin deficiency. There are two types: direct beam X-ray detector and fault profile X-ray detector. Minimum resolution/purpose: 50um overall defect; 10um general PCB detection and quality control, BGA detection; 5um fine distance lead and solder joint detection UM BGA detection, flip-chip detection, PCB defect analysis and process control; 1um bonding crack detection, microcircuit defect detection.
ICT
ICT conducts performance tests for component polarity mis-pasting, component variety mis-pasting, and value exceeding the allowable range of nominal value, and simultaneously checks out related defects affecting its performance, including bridge connection, false welding, open circuit, and component polarity mis-pasting, value exceeding poor, etc., and timely adjusts the production process according to the exposed problems. Contact detection technology. There are two types: The Manufacturing Defect Analyzer MDA (Manutacturing Defects Analyzer), an early form of ICT, which can only simulate test analog circuit panel; The other is ICT, which can test almost all the defects related to the manufacturing process and accurately identify the defective components, mostly using CENTRAL processing unit (CPU) technology.
