In the process of PCBA production, some factors will lead to the occurrence of component drop. At this time, many people will immediately think that it may be caused by the insufficient welding strength of PCBA. Component drop has a great relationship with welding strength, but many other reasons can also cause component drop.
Standard for welding strength of components:
| Components | Standard (≥) | |
| Chip | 0402 | 0.65Kgf |
| 0603 | 1.2Kgf | |
| 0805 | 1.5Kgf | |
| 1206 | 2.0Kgf | |
| Diode | 2.0Kgf | |
| Audion | 2.5Kgf | |
| IC | 4.0Kgf | |
When the external thrust exceeds this standard, the components will fall, which can be solved by replacing the solder paste. However, the components will fall even if the thrust is not so large.
Other reasons for component drop include:
1. the shape of the pad factor, the effort of the circular pad is worse than the rectangular pad.
2. The electroplating of components is not good.
3. PCB moisture absorption produces stratification without baking
4. PCB pads are related to the design and production of PCB pads.
Summary:
PCBA welding strength is not the main reason for component drop, among which there are many reasons, the above is a personal summary of some reasons, I hope it will be helpful to you.
