If after purchasing a new SMT pick and place machine, you are not assured of the manufacturer's labeled mounter accuracy and want to re-measure the mounter accuracy by yourself, how do we test and measure the mounter accuracy and capability?
There are two definitions of pick and place equipment precision: positioning accuracy and repeatability. Positioning accuracy in some industry personnel called to precision. From the original meaning, the mounter precision refers to the mechanical precision of the mounter X, Y axis navigation movement and Z axis rotation precision. It can be characterized by positioning accuracy, repeat accuracy and resolution.
I. Positioning accuracy of Chip mounter
Positioning accuracy refers to the deviation between the actual position of the component to be placed and the position of the component set in the placement file. For example, the mounter mounting component device coordinates for (0, 0), then the positioning accuracy is the actual mounting value and the deviation value of the coordinates of the point.
II. Chip mounter repeatability
Common sense, such as chip mounter mounting component device coordinates for (0, 0), to repeat this point many times, each time between the deviation value is the repeat accuracy. Accurately, each motion system X navigation, l, navigation and p have their own repeatability, their combined results reflect the chip mounter's placement accuracy, so the chip mounter sample accuracy is usually characterized by the repeatability of the mounter!
III. Chip mounter resolution
At present, in the SMT industry, discussing the resolution of the mounter generally refers to the R-axis rotation resolution. When the patch head receives the pulse of the command signal, the patch head R axis will only rotate the number of degrees. To put it more plainly, the number of degrees per turn of the R-axis is called R-axis rotation resolution.
The method of measuring the precision of SMD machine is not the same as that of SMT production factory, SMT production enterprises generally do not have the relevant measuring machine, and often cannot adopt the same precision inspection method as that of SMT machine before leaving the factory. Usually in the SMT workshop using the bonder's downward looking camera way to check the accuracy and ability of the equipment. SMT machine has the equipment to use the lower view camera to check the accuracy of the function of the placement, this way and the SMT machine factory inspection method is basically the same.
In the test component placement, should be used and the mounter factory inspection accuracy of the same PCB board, standard components, mounting methods and distribution of components. After the completion of the test placement, do not send out the PCB board, run the mounter software comes with the detection of components program, the mounter's downward camera will be on the PCB board datum and components for automatic detection. When the test is finished, the mounter software will automatically calculate the accuracy and capability of this chip mounter.
Features of NeoDen N10P Chip Mounter
NeoDen N10P is a high-performance, easy-to-use and stable pick and place machine based on the original NeoDen10. The placement head is equipped with 8 independent nozzles, which can achieve high-speed placement with simultaneous pick up, as well as the maximum placement speed can reach 20,000CPH. It is equipped with a 39-hole fully automatic nozzle replacement device. Meanwhile, it can install a large feeder capacity of up to 80 tape feeders. It adopts imported servo drive with grinding screw configuration to greatly ensure the placement stability and repeated placement accuracy.
It is a cost-effective placement machine that you can rely on.