What are the problems of AOI detection in the SMT Assembly?
In the actual production of SMT SMT, AOI has higher efficiency than manual visual inspection, but after all, the results are obtained through image acquisition and analysis processing. However, software technology related to image analysis and processing has not yet reached the level of the human brain. Therefore, in SMT chip processing, some special cases, such as AOI misjudgment and missing judgment, are inevitable. At present, the main problems of AOI in SMT patch inspection are as follows:
1. It is easy to lead to misjudgment due to different definitions of process requirements for more tin, less tin, offset, and skew.
2. Different capacitance values but the same size and color of capacitance are easy to cause missing judgment.
3. The difference in polarity judgment accuracy caused by different character processing methods is larger.
4. Most of AOI's understanding of false soldering is ambiguous, which leads to the omission of judgment and prevarication.
5. There are detection problems of screen anode, shield cover, and shielding point.
6. It is impossible to detect the solder joints which are invisible to BGA, FC, and other flip components.
7. Most AOI programming is complex, cumbersome, and long adjustment time, which is not suitable for scientific research institutions, small OEM factories, multi specification, and small batch production units.
8. Most AOI products have a slow detection speed, and a few AOI using scanning method have faster speed, but the rate of misjudgment is higher. 9. Some AOI with a low score can not do OCR character recognition detection.
In view of the above problems, in addition to increasing quality inspection personnel, the SMT processing plant also needs auxiliary equipment. AOI has not only online AOI, but also offline AOI equipment. Therefore, we need to attach great importance to the quality control link.
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