Short circuit
between two independent neighbouring solder joints, after the formation of the phenomenon of joining the solder. The reasons for its occurrence include soldering point distance is too close, improper design of parts arrangement, incorrect direction of soldering, too fast soldering speed, insufficient flux coating, and parts of poor solderability, poor solder paste coating, excessive amount of solder paste.
Empty soldering
no tin on the soldering moat, not the parts and the substrate are not soldered together. The reasons for this situation include unclean soldering rift, high foot warping, poor solderability of the parts, the parts are not wide, improper dispensing operations, etc., resulting in the overflow of glue on the soldering rift, and so on.
Standing parts
components are not connected to the line at one end of the soldering, and warped. The main reason is that the product is not designed to lead to uneven heating of the two ends of the component, mounting level offset, pad or component pin end of the oxidation or contamination, paste one end of the leakage of the print or printing offset, and so on.
Side stand
because the component packaging is too loose, improper debugging of equipment leading to patch flying pieces, over the furnace process of wiping the board and so on.
Flip
the original upward component screen printing surface mounted to the bottom. Such anomalies will not affect the realisation of product features, but will have an impact on maintenance. The main reason is that the component packaging is too loose, improper equipment debugging leads to patch flying pieces, over the furnace process by strong vibration and other products.
Tin beads
PCB non-soldering area there are round particles of tin beads. The main reason is that the paste back to the temperature is not enough time, reflow oven soldering temperature is not set properly, improper opening of the stencil and so on.
Pinhole
After printing the solder paste surface there are pinholes. The main reason is insufficient squeegee pressure or squeegee damage, as well as the solder paste is not in accordance with the correct storage method storage leads to oily impurities, fibre impurities and other dirt mixed into the solder paste.
Specification for NeoDen YY1 SMT machine
2. Patent-protected & new needle module is specially designed based on the linear rail with high reliability and durability.
3. Small size with powerful magazines and newly designed tape feeders to support large tape r eels configur ation flexibly, easy to install and r eplace tape r eels conveniently, to ensur e the most excellence solution among all of the entry level machines with lower budget but higher stability.
4. Comes with a high-definition capacitive touch screen, which can be adjusted up and down to meet the needs of different viewing angles and enhance the user experiences.
5. Fully transparent acrylic covers with magnetic mode for a high level of ease of disassembly.