Now the market is very much electronic products, do the process is also very fine, as long as the design to the use of electricity in a variety of intelligent products, will use the circuit board this piece, the following for you to explain the process of SMT production to produce cracks what are the reasons.
SMT processing of welding cracks causes are mainly the following aspects
1. Circuit board pads and components of the welding surface infiltration did not meet the requirements of production and processing.
2. Flux paste does not meet the production standards as required.
3. Soldering and electrical level of the various components of the material thermal expansion coefficient is not symmetrical, spot welding in the condensation of the time is not stable.
4. Reflow oven soldering temperature profile of the standard settings do not have the means to allow the flux paste in the organic chemicals and water in the flow back into the front of the evaporation of the zone.
5. The difficulty of lead-free materials among smt processors is high temperature, high interfacial tension, and high viscosity. The elevated tension of the interface will certainly make the vapour out of the cooling process more difficult, the gas is not easy to discharge, which will make the percentage of cracks a lot more, because of the lead-free soldering in some patch processing there will be a lot of out of gas holes and cracks.
6. In addition, the lead-free soldering temperature will be much higher than the leaded soldering, especially in some of the larger size of the multilayer board, and thermal conductivity of the electronic components, the high value of the temperature is generally to do 260 degrees or so, refrigeration condensation to the indoor temperature of the temperature difference between the temperature will be relatively large, so the lead-free soldering of the ground stress is also relatively large.

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