With the development of modern high-tech, SMT product testing technology is also constantly updated, from the use of magnifying glass or microscope manual visual inspection to a variety of testing equipment endless. But with the SMT mounted zero device precision is getting higher and higher volume is getting smaller and smaller, the human visual inspection ability is far from enough, and SMT automatic optical inspection equipment is more up-to-date, become more efficient amazing! Therefore, with the development of the PCBA industry, the stronger the function, the smaller the volume, AOI will increasingly show its importance.
With the help of AOI, and then people visually inspect, 0402 components below the visual inspection can not be done, you can use the AOI check, and then visually inspect the false alarms, if you use SMT online AOI combined with offline AOI is the best. If only small components of the PCB circuit board, ICT has no place to put the needle, this time with a 3D raster scanning solder paste detector can be fully automated to truly realize the measurement data and product lines, stencils, and printing parameters associated with automatic judgment, automatic generation of reports. SPI imported to bring the benefits of the advantages brought about by the line type 3D solder paste inspection equipment.
1. The introduction of SPI can effectively reduce the original finished PCB failure rate of more than 85%, rework, scrap cost significantly reduced by more than 90%, the factory product quality has improved significantly.
2. SPI and AOI joint use, through the SMT production line real-time feedback and optimization, can make the production quality more stable, greatly shortening the introduction of new products must experience the instability of the trial production stage, the corresponding cost savings.
3. AOI can significantly reduce the rate of misjudgment on the solder, thereby improving the through rate, effectively saving human error correction labor, time costs. According to statistics, the current finished PCB 74% of the unqualified and solder has a direct relationship, 13% have an indirect relationship. SPI through the 3D detection means to effectively make up for the shortcomings of the traditional detection methods.
4. Part of the PCB components such as BGA, CSP, PLCC chips, etc., due to their own characteristics brought about by the light blocking, patch reflow AOI can not be detected. SPI through the process control, minimize the bad situation of these devices after the furnace.
5. Along with the trend of increasing precision and lead-free soldering of electronic products, SMD components are becoming more and more miniature, therefore, the quality of solder paste printing is becoming more and more important, SPI can effectively ensure that the good quality of the solder paste printing, significantly reducing the possible existence of the finished product defective rate appears.
6. As a means of product quality process control, quality hazards can be detected in a timely manner before reflow soldering, so there is virtually no rework costs and the possibility of scrap, effective cost savings.
Features of NeoDen ND800 Online AOI Machine
Inspection system Application
After stencil printing, pre/post reflow oven, pre/post wave soldering, FPC etc.
Program mode
Manual programming, auto programming, CAD data importing
Inspection Items
1. Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc.
2. Component defect: missing or excessive component, misalignment, uneven, edging, opposite mounting, wrong or bad component etc.
3. DIP: Missing parts, damage parts, offset, skew, inversion, etc
4. Soldering defect: excessive or missing solder, empty soldering, bridging, solder ball, IC NG ,copper stain etc.