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Reflow Soldering Factors Affecting Solder Quality

Aug 01, 2022

The solder quality of a solder joint depends on the correct setting of the reflow oven temperature profile. A good reflow profile requires that all mounted components on the PCB must receive excellent solder and that the solder joints should have both excellent appearance and high quality. If the temperature rises too quickly, on the one hand, the components and the PCB will be so hot that the components will be easily damaged and the PCB will be deformed. On the other hand, the solvent in the solder paste evaporates too quickly and the metal compound spills out as a tinned ball. The peak temperature is usually set to 30°C to 40°C above the melting point of the solder paste. If the temperature is too high and the reflow time is too long, heat-resistant components or component plastics can be damaged. Conversely, incomplete melting of the solder paste results in reliable solder joints. To improve the solder quality and to stop the oxidation of the component, nitrogen reflow can be applied.

The reflow profile is usually set according to the following.

a. It can be set according to the recommended temperature profile of the solder paste. The composition of the solder paste determines its activation temperature and melting point.

b. Depending on the thermal performance parameters of heat resistant components and valuable components, the maximum soldering temperature must be considered for some special components.

c. The setting should be based on the material, size, thickness and weight of the PCB substrate.

d. The settings should be based on the structure of the reflow oven and the length of the temperature zone, and different reflow ovens should have different settings.

NeoDen IN6 reflow oven

The table-top design of the product makes it a perfect solution for production lines with versatile requirements. It is designed with internal automation that helps operators provide streamlined soldering.

The new model has bypassed the need for a tubular heater, which provides even temperature distribution throughout the reflow oven. By soldering PCBs in even convection, all components are heated at the same rate.

Temperature can be controlled with extreme accuracy—users can pinpoint heat within 0.2°C.

An internal temperature sensor ensures full control of the heating chamber and can reach optimal temperatures in as little as fifteen minutes.

The design implements an aluminum alloy heating plate that increases the energy-efficiency of the system. The internal smoke filtering system improves the product’s performance and reduces harmful output, too.

Working files are storable within the oven, and both Celsius and Fahrenheit formats are available to users.

N4+IN6

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