The application of X-Ray inspection machine in SMT package inspection is becoming increasingly important due to the increasing requirements for low cost, high efficiency and reliability needed for SMT packaging. X-Ray inspection machine can quickly locate and inspect components in SMT packages to ensure the quality of the package. So, what are the applications of X-Ray inspection equipment?
1. The core technology of X-Ray inspection equipment is X-ray irradiation, which can detect objects from the depths, so as to detect the details inside the object.
In SMT package inspection, X-Ray inspection equipment can quickly locate the position of the package components, and can carry out positioning degree detection, reflow oven welding condition detection, component misalignment detection, etc. to ensure the quality of the package components.
2. X-Ray inspection equipment can be used to detect the welding condition of the components.
X-Ray inspection equipment can detect welding defects, such as detecting whether the solder balls of BGA package chips have short-circuiting, false welding, bubbles or offset problems, checking the quality of the solder joints of the QFN package components to ensure a reliable connection, so as to effectively improve the quality of the package.
3. X-Ray inspection machine can be used to check whether there are broken wires, short circuits or other defects in PCB internal alignments, over-holes and inter-layer connections.
Component positioning in multi-layer PCB boards is highly required, if the component positioning is inaccurate, it will lead to PCB boards can not work properly, so X-Ray inspection equipment plays an important role in this regard.
4. X-Ray inspection equipment can be used to detect component positional accuracy in SMT packages.
SMT packages require precise component positioning, so X-Ray inspection equipment can be used to ensure the quality of the package by detecting the positional accuracy of the components.
5. X-Ray inspection equipment can be used to detect the thickness of the solder.
The thickness of the solder determines the quality of the SMT package, if the solder is too thin, it will affect the quality of the package, so X-Ray inspection equipment can detect the thickness of the solder to ensure the quality of the package.
6. X-Ray inspection equipment can be used for PCB rework and failure analysis.
Rework Inspection:
Use X-Ray inspection equipment in the rework process to ensure the quality of solder joints and connections after rework.
Failure analysis:
X-Ray inspection of failed PCBs or components to analyze the cause of failure.
X-Ray inspection equipment can quickly locate and inspect components in SMT packages to ensure package quality. In addition, X-Ray inspection equipment can also be used to detect component positioning, component positional accuracy and solder thickness in multi-layer PCB boards to ensure the quality of SMT packages, which is critical in SMT assembly lines.
Features of NeoDen 56X X-Ray Machine
1. Miniaturized equipment, easy to install and operate.
2. Applicable to Chip, LED, BGA/CSR Wafer, SOP/QFN, SMT and PTU packaging, Sensors, Connectors, and Precision Castings inspection.
3. High resolution design to get the best image in a very short time.
4. Infrared automatic navigation and positioning function can select the shooting location quickly.
5. CNC inspection mode which can quickly and automatically inspect multi-point array.
6. Inclined multi-angle inspection makes it easier to inspect sample defects.
7. Simple softwareoperation, low operating costs
8. Long lifespan.