In electronic manufacturing, wave soldering equipment is one of the most important and commonly used soldering processes in the PCBA process, as it provides strong support in assembling components and connecting wiring. However, in practice, wave soldering machine also brings some process difficulties that make many PCBA assemblies more difficult.
PCBA wave soldering process problems and solutions
1. Component density
With the rapid development of technology, the density of components on the PCBA is getting higher and higher. This means that smaller components require a denser layout, and wave soldering manufacturers need to make some fine-tuning of the soldering process to ensure that each solder joint is fully melted.
Measure
- Adjust soldering parameters such as heating temperature, alloy composition of the solder, etc. to ensure that melting will occur at the right time and in the right place.
- Use higher grade wave soldering machine and solder for better soldering results.
2. Surface treatment
PCBA wave soldering must be preceded by surface treatment. This process involves many steps, such as chemical cleaning, mechanical polishing, etc.. If these steps are incorrect or insufficient, it will affect the wave soldering effect of PCBA.
Measure
- Use better surface treatment processes and equipment for better cleaning results.
- Regularly check the surface treatment process to ensure that each step has been properly executed.
3. Solder Paste Quality
Solder paste is one of the most important factors in the wave soldering process. If the solder paste is not of good quality, then the quality after soldering cannot be guaranteed. Some of the common problems include dry solder paste and insufficient viscosity.
Measure
- Use a better brand of solder paste to ensure that the quality of solder paste is guaranteed.
- Regularly check the solder paste to ensure that its viscosity, shelf life and other indicators in line with the provisions.
4. Circuit board deformation
In the wave soldering machine process, the circuit board may be deformed due to high temperature. This problem will not only lead to a decrease in the quality of the soldered joints, but may also lead to damage to the circuit board itself.
Measure
- Use better circuit board materials and structures to maintain a stable shape during the wave soldering process.
- Adjust the soldering parameters to control the heating temperature and soldering time to minimize the deformation of the board.
5. Ambient temperature and humidity
Ambient temperature and humidity will also affect the wave soldering. If the temperature and humidity are too high, then the quality of the solder joint will be greatly reduced. This problem can also lead to damage to the components on the board.
Measure
- Maintain good ventilation to ensure that the ambient temperature is not too high.
- Regulate ventilation to maintain proper humidity levels.
Company Profile
Zhejiang NeoDen Technology Co., Ltd. has been manufacturing and exporting various small pick and place machines since 2010. Taking advantage of our own rich experienced R&D, well trained production, NeoDen wins great reputation from the world wide customers.
with global presence in over 130 countries, the excellent performance, high accuracy and reliability of NeoDen PNP machines make them perfect for R&D, professional prototyping and small to medium batch production. We provide professional solution of one stop SMT equipment.
We believe that great people and partners make NeoDen a great company and that our commitment to Innovation, Diversity and Sustainability ensures that SMT automation is accessible to every hobbyist everywhere.