1. For products with poor quality, use a soft scraper to scrape off the solder paste on the board surface, recycle the solder paste with an empty bottle with a red label, and then clean the residual solder paste on the board surface and in the hole with a washing water brush, and then blow clean with a tool.
2. When cleaning the substrate, it is necessary to distinguish the place and make "△" mark with an oily pen on the edge of the plate to be confirmed by IPQC. After OK, it is uniformly placed in the oven to bake.
3. Manual cleaning steel mesh, wipe the machine in manual state, with a little cleaning liquid dust-free paper, wipe from the bottom of the steel mesh. Clean the hole and then blow the residual solder paste from bottom to top with the tool. It depends on the quality. If there is any bad situation for 3 times in a row, it needs to report to the engineering immediately for adjustment.
4. When good products are placed on the grid, they are placed between layers. Complete the machine type and work order status in the process identification card.
5. After printing, PCB stacking shall not exceed 1 hour.
6. When adding solder paste, the rolling amount of the scraper shall prevail, and the missing solder paste on both sides of the scraper shall be received into the scraper in time.
7. The lamp should be turned off when the equipment is not in use.
8. The project regularly a week to check the blade wear condition, generally regularly replace once a half a year is better.