+86-571-85858685

How To Improve The Quality Of Circuit Board Design?

May 21, 2024

PCB design is one of the crucial aspects of modern electronics, good design principles and layout skills directly affect the performance, reliability and stability of the board.

1. Electromagnetic compatibility design principles

Good electromagnetic compatibility design principles include.

Ground design

Reasonable planning of the ground return path, to avoid the loop is too large or too long, to reduce electromagnetic interference.

Signal line planning

try to separate the layout of high-frequency signal lines and low-frequency signal lines to reduce the interference between signals.

Impedance matching

For high-speed signal lines, use impedance matching design to reduce signal reflection and loss.

2. Component layout and hierarchical planning

Good component layout and PCB hierarchical planning can improve the performance and stability of the board.

Component Layout

Place key components in appropriate locations to reduce signal transmission paths and reduce electromagnetic interference.

PCB hierarchy planning

Reasonable planning of PCB hierarchy, separate layout of signal, power and ground layers to reduce signal traversal and interference.

3. Power line and ground line design skills

Power line and ground line design is critical to the stability and reliability of the board.

Power line width

For high power devices, the width of the power line and copper laying area should be considered to ensure stable current transmission.

Ground return path

Avoid long ground return paths or large loops to reduce ground interference.

4. High-speed signal line wiring rules

For high-speed signal line wiring, need to follow certain rules and techniques.

Length matching

Try to keep the length of high speed signal line matching to reduce the difference of signal arrival time.

Differential signaling

Adopt differential signaling wiring to improve anti-interference capability and signal integrity.

5. Thermal Management and Dissipation Design

For high power boards, thermal management and heat dissipation design are also key design considerations.

Layout of heat-sensitive components

Keep heat-sensitive components away from heat sources to avoid overheating and causing equipment failure.

Thermal design

Add heat sinks, heat sinks, or fans and other cooling devices to ensure the normal operating temperature of the board.

YS350N10IN12C

Features of NeoDen10 Surface Mount Machine

1. 8 independent heads with fully closed-loop control system support all 8mm feeder pick up simultaneously, speed up to 13,000 CPH.

2. Equips double mark camera + double side high precision flying camera ensure high speed and accuracy, real speed up to 13,000 CPH.

Using the real-time calculation algorithm without virtual parameters for speed counting.

3. Patented sensor, besides common PCB, can also mount black PCB with high accuracy.

4. Raise PCB automatically, keeps PCB on the same surface level during placement, ensure high accuracy.

5. Programming interface, easy to operate, more intelligent

1.1- Click to import coordinates, can identify top/bottom layer.

automatically get the existing component footprint library, factory standard footprint library.

2.1- Click to add similar footprint library, only need add once, existing footprint library can be automatically identified.

3.1- Upgrade software FOC for life time.

Send Inquiry