1. Use good solderability components and PCBs
Selection of good solderability components and PCBs can reduce the wave soldering machine when the case of bridging. Good solderability components and PCB surface coating materials easy to weld, and the size and location of the pad is more accurate, these factors can reduce the possibility of bridge.
2. Improve the activity of flux
Flux can help remove oxides, enhance the wetting properties of the solder, thereby improving the quality of welding. Improve the activity of the flux can reduce the possibility of bridging, because the flux can better wet the pad, so that the welding more uniform.
3. Preheat and increase pad wetting performance
Preheat the PCB can help the solder in the welding better flow, increase the pad wetting performance, thereby improving the quality of welding. Preheating temperature can be determined according to the specific PCB and components, generally can be increased to the appropriate temperature, such as 80 ℃ or so.
4. Improve the temperature of the solder
Increase the temperature of the solder can help the solder flow better when welding, so that the welding is more uniform. However, it should be noted that increasing the temperature of the solder may cause damage to the components and PCB, so you need to determine the appropriate soldering temperature according to the specific components and PCB.
5. Remove harmful impurities
Harmful impurities may affect the wetting properties of the solder, so that the quality of soldering degradation. Therefore, the need to remove harmful impurities before welding, reduce the cohesion of the solder, in order to facilitate the separation of the solder between the two solder joints. You can use some cleaning methods, such as detergent, alcohol, compressed air, etc. to remove harmful impurities.
Features of NeoDen ND250 wave soldering machine
Heating Method: Hot Wind
Cooling method: Axial fan cooling
Transfer Direction: Left→Right
Temperature Control: PID+SSR
Machine Control: Mitsubishi PLC+ Touch Screen
Flux tank capacity: Max 5.2L
Spray Method: Step Motor+ST-6
Specification
| Product Name | Wave Soldering Machine | Preheating Zones | Room temperature-180℃ |
| Wave | Double Wave | Solder temperature | Room Temperature-300℃ |
| Tin tank capacity | 200KG | Machine size | 1800*1200*1500mm |
| Preheating | 800mm (2 section) | Packing size | 2600*1200*1600mm |
| Wave Height | 12mm | Transfer speed | 0-1.2m/min |
| PCB Conveyor Height | 750±20mm | Air source | 4-7KG/CM2 12.5L/Min |