Hybrid integrated circuit
Characteristic
The hybrid integrated circuit is to concentrate the functional parts of all the components in a circuit on one substrate, which can basically eliminate the assembly gap and solder joint between the auxiliary parts and the components in the electronic components, so it can improve the assembly density and reliability of the electronic equipment. Because of this structure, the hybrid IC can be regarded as a distributed parameter network, which has the electrical performance that is hard to be achieved by the discrete element network. Another characteristic of hybrid integrated circuits is to change the sequence, thickness, area, shape, and properties of the conductor, semiconductor, and dielectric films as well as their leading positions to obtain passive networks with different performances.
Type
There are two kinds of film-forming technologies commonly used in manufacturing hybrid integrated circuits: screen printing sintering and vacuum film making. The film made by the former technology is called a thick film, and its thickness is generally more than 15 microns. The film made by the latter technology is called a thin film, with the thickness ranging from hundreds to thousands of Angstroms. If the passive network of the hybrid integrated circuit is a thick film network, it is called thick-film hybrid integrated circuit; if it is a thin-film network, it is called a thin-film hybrid integrated circuit. In order to meet the requirements of miniaturization and integration of microwave circuits, there are also microwave hybrid integrated circuits. According to the concentration and distribution of component parameters, this kind of circuit can be divided into two parts: concentrated parameter and distributed parameter microwave hybrid integrated circuit. The structure of the lumped parameter circuit is the same as that of the general thick-film hybrid integrated circuit, but it requires higher dimensional accuracy. But the DPC is different. Its passive network is not made up of externally distinguishable electronic components, but all of them are made up of microstrip lines. Because of the high requirement for the size accuracy of the microstrip line, the distributed parameter microwave hybrid integrated circuit is mainly made by thin-film technology.
Basic process
In order to facilitate automatic production and close assembly in electronic equipment, the manufacturing of hybrid integrated circuit adopts a standardized insulating substrate. The most commonly used are rectangular glass and ceramic substrates. One or several functional circuits can be made on one substrate. In the process of fabrication, membrane passive components and interconnects are made on the substrate to form a passive network, and then semiconductor devices or semiconductor integrated circuit chips are installed. Membrane passive network is made by photolithography and film-forming. According to a certain process sequence, conductors, semiconductors, and dielectric films with different shapes and widths are fabricated on the substrate. These films are combined with each other to form various electronic components and interconnects. After the whole circuit is made on the substrate, the lead-out wire is welded, if necessary, the protective layer is coated on the circuit, and finally, a hybrid integrated circuit is formed by sealing with the shell.
Application development
Hybrid integrated circuits are mainly used in analog circuits and microwave circuits, and also in special circuits with high voltage and high current. For example, data conversion circuit, digital to analog and analog to digital converter in a portable radio station, airborne radio station, electronic computer and microprocessor, etc. In the field of microwaves, the application is particularly prominent.
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