Chips have been widely used in all walks of life, in all kinds of packaging methods, BGA has the characteristics of less packaging area, increased function, increased number of pins, high reliability, good electrical performance, low overall cost. For example, the north and South bridge of the computer motherboard is BGA, and the LCD TV motherboard also uses BGA chip.
The full name of BGA is Ball Grid Array. It is a pin package for large components. Similar to the four pins of QFP, BGA is connected to the circuit board by SOLDERING with SMT solder paste. The difference is the "one-degree space" single-row pins, such as gull-wing extenders, flat extenders, or j-shaped pins retracted to the underside; Change to ventral full array or local array, adopt two dimensional area of solder ball pin distribution, as a chip package to the circuit board welding interconnection tool.
BGA repair station, as the name implies, is used to repair BGA. It is the equipment for reheating welding of BGA which is not well welded. Laptop, mobile phone, XBOX, desktop motherboards, all use BGA repair desk to repair.
The use of BGA repair table can be roughly divided into three steps: disassembly welding, mounting, welding.
Desoldering
1. For the BGA chip to be repaired, select the air nozzle to be used. The PCB main board is fixed on the BGA repair table, the laser red spot is positioned at the center of the BGA chip, and the mounting head is shaken down to determine the mounting height.
2. Set the disassembly temperature, and store it, so that it can be directly called when repairing. Switch to the disassembly mode, click the repair button, the heater will automatically heat the BGA chip. When the temperature curve is finished, the suction nozzle will automatically suck up the BGA chip, and when it rises to the initial position, the operator can connect the BGA chip with the material box. At this point, disassembly welding completed.
Pick and place
1. after the completion of tin removal on the pad, use a new BGA chip, or BGA chip after planting. Fixed PCB board. Place the BGA to be welded approximately at the pad position.
2. Switch to the mounting mode, the mounting head will automatically move down, and the suction nozzle will suck up the BGA chip to the initial position.
Welding
1. Open the optical counterpoint lens, adjust the micrometer, adjust the front, back, left and right of the PCB board on the X-axis and Y-axis, and adjust the BGA Angle on the R Angle. The tin ball on the BGA (blue) and the solder spot on the pad (yellow) can be displayed in different colors on the display. After adjusting the solder ball and solder joint completely coincide, click the "matching complete" key.
2. The mounting head will drop automatically. Put BGA on the pad and then heat it up.
