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How To Prevent PCBA Soldering Porosity Problem?

Jun 13, 2022

PCBA soldering air holes, which is often referred to as air bubbles, are generally generated during reflow oven soldering and wave soldering machine, so how to improve the problem of PCBA soldering air holes?

1. Baking

PCB and components exposed to the air for a long time to bake to prevent moisture.

2. Control of solder paste

Solder paste contains moisture is also easy to produce porosity, tin beads. First of all, choose good quality solder paste, solder paste tempering, stirring according to the operation of strict implementation, solder paste exposed to the air for as short a time as possible, after printing solder paste, the need for timely reflow soldering.

3. Humidity control in the workshop

Plan to monitor the humidity in the workshop, control between 40-60%.

4. Setting a reasonable furnace temperature curve

Twice a day for the furnace temperature test, optimize the furnace temperature curve, the rate of temperature rise can not be too fast.

5. Flux spraying

In the over wave soldering, the amount of flux spraying can not be too much, spraying reasonable.

6. Optimize the furnace temperature curve

The temperature of the preheating zone needs to meet the requirements, not too low, so that the flux can be fully volatile, and the speed of the furnace can not be too fast.

There may be many factors affecting the PCBA welding bubbles, which can be analyzed from the PCB design, PCB humidity, furnace temperature, flux (spray size), chain speed, tin wave height, solder composition, etc. It needs to be debugged several times before it is possible to come up with a better process.

NeoDen IN12C features

1. Built-in welding fume filtration system, effective filtration of harmful gases, beautiful appearance and environmental protection, more in line with the use of high-end environment.

2. The control system has the characteristics of high integration, timely response, low failure rate, easy maintenance, etc.

4. Hot air convection, excellent welding performance.

5. The use of high-performance aluminum alloy heating plate instead of heating tube, both energy-saving and efficient, compared with similar reflow ovens on the market, the lateral temperature deviation is significantly reduced.

6. The heat insulation protection design, the shell temperature can be effectively controlled.

ND2+N10+AOI+IN12C

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