There are four types of packaging for surface assembly components: bulk, disk braided packaging, tube packaging and tray packaging.
1. Bulk packaging
SMC components without leads or polarity can be bulk packed, such as general rectangular and cylindrical capacitors and resistors. The cost of bulk components is low, but is not conducive to automated equipment pick and place.
2. Disk braided tape packaging
Braided tape packaging is suitable for components other than large size QFP, PCC, LCCC chip, its specific form has paper braid, plastic braid and adhesive braid three kinds.
Paper Braid. The paper braid consists of a bottom tape, a carrier tape, a cover tape and a paper winding tray (tape tray). The small round hole on the carrier tape is a positioning hole for the gear drive on the feeder; the rectangular hole is a material-bearing cavity for placing components. When using paper braided tape for component packaging, the thickness of the components and the thickness of the paper tape, paper braided tape can not be too thick, otherwise the feeder can not drive, therefore, paper braided tape is mainly used for packaging 0805 specifications (including) the following chip resistors, chip capacitors (with a few exceptions). The paper tape is generally 8mm wide, and the packaging components are coiled on a plastic paper winding tray afterwards.
Plastic braided tape. The plastic braided tape has approximately the same structure and size as the paper braided tape, but the difference is that the cassette is convex in shape. When mounting, the upper peeling device on the feeder removes the film cover tape and then picks up the material.
Paper braid and plastic braid have a row of positioning holes on one side, for the bonder to guide the paper tape forward and positioning when picking up components. Positioning holes for the hole distance of 4mm (less than 0402 series components of the tape hole distance of 2mm). The spacing of components on the tape depends on the length of the components, generally a multiple of 4mm. The reel of tape packaging is made of polystyrene (PS) material and consists of 1 to 3 parts, which are blue, black, white or transparent and are usually recyclable.
Bonded braid. Adhesive braided tape has a tape on the bottom side and ICs are attached to the tape and are driven in double rows. The ICs are attached to the tape and the tape is driven in two rows. When the tape is attached, the feeder is equipped with a lower peeling device. Adhesive braiding tape is mainly used to package larger size chip components, such as SOP, chip resistor network, delay lines, etc.
3. Tube-type packaging
Tube packaging is mainly used for SOP, SOJ, PLCC integrated circuits, PLCC sockets and shaped components, etc. From the production type of the whole product, tube packaging is suitable for many varieties and small batches of products. Packaging tube (also known as material strip) is composed of transparent or translucent polyvinyl chloride (PVC material, extruded to meet the requirements of the standard shape, the number of parts per tube ranging from dozens to nearly a hundred tube packaging, the direction of the components in the tube with consistency, can not be installed in reverse.
4. Pallet packaging
Pallets made of toner or fiber material, usually requires exposure to high temperatures of components pallets with 150 ℃ or higher temperature resistance. Tray cast into a rectangular standard shape, containing a uniform matrix of interlocking cavities, cavities to hold components, providing protection for components during transport and handling. The spacing provides accurate component placement for standard industrial automation equipment used for placement during board assembly. Components are arranged in trays with the standard orientation of placing the first pin in the tray's mitered corner. Tray packaging is primarily used for devices such as QFP, narrow pitch SOP, PLCC, and BCA integrated circuits.
