Solder paste printer printing is a very important part of the SMT process, and many of the problems of poor soldering occur in this area. In the process of printing solder paste, due to human error, the board is placed backwards or the stencil and board position is not right, will lead to misprinted solder paste on the board, this situation should be how to do? The following article tells you a simple and effective way to remove the problem of misprinted solder paste.
When the misprinted solder paste on the circuit board substrate, to use a scraper to scrape a layer of solder paste on the circuit board.
2. Clean with board wash water
But after scraping the scraper, the solder paste on the pad is not easy to scrape off, so you also need to use the wash board water for cleaning. When washing the plate, but also early with the washboard water to wash off the solder paste, otherwise over time, the solder paste will become dry, the cleaning will not be so convenient.
After washing the board water cleaning, you can use the special stencil wipe paper to wipe the circuit board substrate to clean.
Finally, the use of air guns to blow dry the circuit board substrate, then you can get a clean board can be re-printed.
In the cleaning of misprinted solder paste, do not use ordinary rags to wipe the paste, easy to make the paste and other pollutants contaminated circuit board, you can use ultrasonic cleaning machine to clean.
Due to the relatively low cost of manual cleaning, simple and fast, is the current SMT processing plant often used methods.
