General Requirements for SMD Components
It is recommended that fine pitch devices be placed on the same side of the PCB and larger devices (such as inductors) be arranged on the top side.
Polarized components should be aligned such that all the positive poles are on one side of the board and negative poles on the other where possible. Avoid positioning taller components next to shorter ones, which may hinder inspection. A viewing angle of no less than 45 degrees must be maintained throughout the layout to aid manual solder joint inspection.
Surface array devices such as CSP, BGA, must have a clearance area of 2mm, but 5mm is ideal.
In general, surface array devices should not be placed on the bottom side of the board. In the event there is, other surface array devices should not be placed on the top side, in a region including the outline of the surface array device extending 8.00mm outwards, see Figure 17; In the event there is, the same region on the top layer, with an additional 8mm boarder about this region, must not contain surface array devices.
SMD Component Placement Requirements
All SMD components shall be smaller than 50mm on at least one side.
It is not recommended for two surface-mount gullwing pin devices to overlap, for example, SOP packages as shown in Figure 18.
In the event that solder pads are shared between two SMD components, the packages must be the same.
Through-hole devices and SMD components are allowed to overlap when it can be confirmed that the SMD pad and the solder paste printed thereon has no effect on the soldering of the through-hole device.
The required distance between SMD components is
Same component: ≥ 0.3mm Different components: ≥ 0.13 × h + 0.3mm (where h is the maximum height difference of the surrounding neighbors)
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