1. Poor wettability.
Performance in the PCB pads to eat tin bad or components pins to eat tin bad.
Causes: component pins / PCB pads have been oxidation / pollution.
too low reflow soldering temperature.
poor quality of solder paste, will lead to poor wettability, there will be serious false solder.
2. The amount of tin is very little.
Performance is not full of solder joints, IC pin root of the moon bend surface is small.
Causes: printing template window is small.
wick phenomenon (poor temperature profile); low metal content of solder paste. One of the above reasons will lead to a small amount of tin, the strength of the solder joint is not enough.
3. Pin damage.
Performance in the device pin coplanarity is not good or bending, directly affecting the quality of welding.
Causes: transport / pick up and put when touching bad, should be careful to keep components, especially FQFP.
4. Pollutants cover the pads.
Occurs from time to time in production.
Causes: from the field of paper; from the foreign body of the tape; manual touch PCB pads or components; character map position is not correct. Production should pay attention to the cleanliness of the production site, the process should be standardized.
5. Insufficient amount of solder paste.
Is also a frequent phenomenon in production.
Causes: the first PCB printing / machine stop after the printing; printing process parameters change; steel plate window blocking; solder paste quality deterioration.
6. Solder paste is angular.
Production often occurs and not easy to find, serious will even solder.
Causes: printing machine lifting speed is too fast; template hole wall is not smooth, easy to make the solder paste is yuan Bao shape.
1. Built-in welding fume filtration system, effective filtration of harmful gases, beautiful appearance and environmental protection, more in line with the use of high-end environment.
2. Unique heating module design, with high precision temperature control, uniform temperature distribution in the thermal compensation area, high efficiency of thermal compensation, low power consumption and other characteristics.
3. The use of high-performance aluminum alloy heating plate instead of heating tube, both energy-saving and efficient, compared with similar reflow ovens on the market, the lateral temperature deviation is significantly reduced.
4. Intelligent, integrated with the PID control algorithm of the custom-developed intelligent control system, easy to use, powerful.
5. Custom-developed track drive motor according to the characteristics of the B-type mesh belt, to ensure uniform speed and long life.
