BGA (Ball Grid Array) package, that is, ball grid array package, it is in the bottom of the package body substrate to create an array of solder balls as the circuit I/O terminals and printed circuit board (PCB) interconnection. Adopt this technology package device is a kind of surface mount type device. Compared with the traditional foot-mounted device (LeadedDe~ce such as QFP, PLCC, etc.), the BGA package device has the following characteristics.
1. I/O number is more. the I/O number of BGA package device is mainly decided by the size of the package body and the pitch of the solder ball. Since the solder balls of BGA package are arranged in an array under the package substrate, it can greatly increase the I/O count of the device, reduce the package body size and save the occupied space for assembly. Typically, the package size can be reduced by more than 30% with the same number of leads. For example: CBGA-49, BGA-320 (pitch 1.27mm) compared with PLCC-44 (pitch 1.27mm) and MOFP-304 (pitch 0.8mm), the package size is reduced by 84% and 47% respectively.
2. Improved placement yield and potential cost reduction. The traditional QFP, PLCC device lead pin uniformly distributed in the package body around, its lead pin pitch is 1.27mm, 1.0mm, 0.8mm, 0.65mm, 0.5mm. When the I/O number is more and more, its pitch must be smaller and smaller. And when the pitch <0.4mm, the accuracy of SMT equipment is difficult to meet the requirements. Plus the lead foot is very easy to deformation, thus leading to the mounting failure rate increase. Its BGA device solder ball is distributed in array form in the bottom of the substrate, can arrange more I/O number, its standard solder ball pitch is 1.5mm, 1.27mm, 1.0mm, detail pitch BGA (printed BGA, also called CSP-BGA, when the pitch of solder ball <1.0mm, can be classified as CSP package) pitch is 0.8mm, 0.65mm The pitch of CSP-BGA is 0.8mm, 0.65mm, 0.5mm, which is compatible with the existing SMT process equipment, and its mounting failure rate is <10ppm.
3. The contact surface of BGA array ball and substrate is large and short, which is conducive to heat dissipation.
4. The short pins of BGA array solder balls shorten the signal transmission path and reduce the lead inductance and resistance, thus improving the performance of the circuit.
5. It obviously improves the coplanarity of I/O side and greatly reduces the loss caused by poor coplanarity during the assembly process.
6. BGA is suitable for MCM package and can realize high density and high performance of MCM.
7. Both BGA and ~BGA are more robust and reliable than ICs in foot-shaped packages with detailed pitch.
Zhejiang NeoDen Technology Co., LTD., founded in 2010, is a professional manufacturer specialized in SMT pick and place machine, reflow oven, stencil printing machine, SMT production line and other SMT Products.
We believe that great people and partners make NeoDen a great company and that our commitment to Innovation, Diversity and Sustainability ensures that SMT automation is accessible to every hobbyist on everywhere.
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