Ball Grid Array (BGA) Package

Ball Grid Array or BGA is a surface-mount package (with no leads) utilizing an array of metal spheres (solder balls) for electrical interconnection. BGA solder balls are attached to a laminated substrate at the bottom of the package. The die of the BGA is connected to the substrate by wire bonding or flip-chip technology. The BGA substrate has internal conductive traces that route and connect the die-to-substrate bonds to the substrate-to-ball array bonds.

BGA is soldered on to the Printed Circuit Board using a reflow oven. As the solder balls melts in the reflow oven, the surface tension of the molten solder ball keeps the package aligned in its proper location on the circuit board, until the solder cools and solidifies. Proper and controlled soldering process and temperature is essential for good solder joints and to prevent solder balls from shorting with each other.

NeoDen provide a full smt assembly line solutions, including SMT reflow oven, wave soldering machine, pick and place machine, solder paste printer, PCB loader, PCB unloader, chip mounter, SMT AOI machine, SMT SPI machine, SMT X-Ray machine, SMT assembly line equipment, PCB production Equipment smt spare parts etc any kind SMT machines you may need, please contact us for more information:

Hangzhou NeoDen Technology Co.,Ltd

Add: Building 3,Diaoyu Industrial and Technology Park,No.8-2,Keji Avenue, Yuhang District, Hangzhou，China

E-mail: steven@neodentech.com

Phone:86-18167133317

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automatic pick and place machine