The heat resistance and thermal expansion characteristics of the substrate do not match the component layout, solder, welding process and temperature, resulting in warping/distortion of the PCB and serious welding defects.
Substrate solderability coating material variation, or its heat resistance, welding resistance and so on does not match the solder, welding process temperature, resulting in poor wettability or over-wettability and other poor weldability.
The solderable coating or solderable resistance material does not meet the application requirements of the relevant process and causes corrosion of the plate surface.
PCB solderable coating process is out of control, the surface of copper foil is seriously oxidized or polluted, the characteristics of the solderable coating material are different, or its heat resistance and solderable resistance are not consistent with the solder and welding process temperature, etc., resulting in the exposure of copper in the solder pad.
No resistance welding or resistance welding off, wire wiring spacing is too small, PCB wiring over tolerance, resulting in conductor welding.
The heat resistance of the substrate is poor, and the laminating process and material quality are out of control, resulting in PCB lamination and foaming.
NeoDen provides a full SMT assembly line solutions, including SMT reflow oven, wave soldering machine, pick and place machine, solder paste printer, PCB loader, PCB unloader, chip mounter, SMT AOI machine, SMT SPI machine, SMT X-Ray machine, SMT assembly line equipment, PCB production Equipment SMT spare parts, etc any kind SMT machines you may need, please contact us for more information:
Zhejiang NeoDen Technology Co., Ltd
Email: info@neodentech.com