NeoDen YS1200 PCB Stencil Printer
■ 1200 mm * 240 mm Max PCB size
■ 0.2 mm ~ 2.0 mm PCB thickness
■ 1300 * 320 mm Printing area
NeoDen YS1200 PCB Stencil Printer is used for PCB screen printing with high precision and flexibility.
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Product Details ofNeoDen YS1200 PCB Stencil Printer
Introduction of NeoDen YS1200 Semi-automatic stencil printer
The NeoDen YS1200 is a semi-automatic stencil printer designed to boost the efficiency of SMT production lines. The device is controlled by a PC with an intuitive touch screen interface. Its floating scraper and adjustable pressure functions ensure high-precision printing, with flexible adjustments for different PCBs and stencils. Multiple PCB localization methods further guarantee printing accuracy. For added safety, both hands are required to operate the machine. With its independently adjustable parameters and controllable process, the NeoDen YS1200 is a reliable choice for improving your production efficiency and product quality.
Why Choose NeoDen YS1200 Solder paste printer?
【High Precision & Flexibility】 The scraper pressure is adjustable based on its length. The scraper floats freely up and down, automatically leveling with the stencil, similar to an automatic printer. The PCB can be localized and fastened by base hole, base side, both base hole and base side, or template localization, offering versatile options.
【Easy & Safe Operation】 It features PC control with a touch screen display and a menu operation interface. Both hands are required to press buttons to operate the machine, ensuring safety and reliability.
【Independently Adjustable Parameters】 The stopping time of the scraper at top/bottom left or top/bottom right, as well as the overall stopping time of the stencil at the top or bottom, can be independently set on the touch screen menu. The scraper speed is also adjustable.
【Controllable Process】 The process of the stencil removing from the PCB is adjustable from 0 to 5 seconds. The printing time can be displayed and counted on the touch screen.
Specification
| Product name | NeoDen YS1200 PCB Stencil Printer | PCB thickness | 0.2-2.0mm |
| PCB size max | 1200*240mm | Air source | 4-6kg/cm2 |
| Printing area | 1300*320mm | Power supply | AC220V 50HZ |
| Frame size | L(1550-1650)*W(370-470) | Dimension | L 1600*W 700*H 1700 (mm) |
| Printing/repeating accuracy | +/-0.2mm | Packing size | 1900*900*1850 (mm) |
| N.W./G.W. | 300/350 Kg |
Our Service
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More Professional service in PNP machine field.
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Better manufacture ability.
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Various payment term to choose: T/T, Western Union, L/C, Paypal.
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High quality/Safe material/Competitive price.
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Small order available.
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Quickly response.
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More safe and fast transport.
Package
Provide one-stop SMT assembly production line
If any PCB assembly production line required, SMT PCB printer Semi-auto solder printer+ pick and place machine+ smt conveyor+ reflow soldering oven can be supplied.
About us
factory
Zhejiang NeoDen Technology Co., Ltd. has been manufacturing and exporting various small pick and place machines since 2010. Taking advantage of our own rich experienced R&D, well trained production, NeoDen wins great reputation from the world wide customers.
With global presence in over 130 countries, the excellent performance, high accuracy and reliability of NeoDen PNP machines make them perfect for R&D, professional prototyping and small to medium batch production. We provide professional solution of one stop SMT equipment.
certification
exhibition
If you need, please feel free to contact us for more information.
FAQ
Q1. What causes solder paste sticking to the stencil apertures?
- Aperture design: Tapered walls (e.g., laser-cut stencils) reduce adhesion.
- Paste quality: Use Type 3/4 pastes with proper viscosity (e.g., 800–1,200 kcps).
- Environment: Control humidity at 40–60% RH to prevent paste drying.
Q2. How can I extend the squeegee blade lifespan?
- Material: Use polyurethane blades (60–80 Shore hardness) for durability.
- Rotation: Flip blades every 4–8 hours to distribute wear evenly.
- Storage: Keep blades in a dark, dry place to prevent UV/humidity degradation.
Q3. How to optimize solder paste release from stencil apertures?
- Ensure stencil thickness matches component pitch (e.g., 0.1mm for 0201 components)
- Maintain proper aperture wall geometry (laser-cut + electro-polished recommended)
- Control printing environment at 25±2°C/50±10%RH
- Use Type 3 or 4 solder paste with 90-95% metal content
Q4. What causes poor print definition (smearing/skipping)?
- Insufficient squeegee pressure (adjust to 4-6kg force)
- Worn squeegee blades (replace every 50,000-80,000 prints)
- Improper stencil-PCB separation speed (0.1-0.5mm/sec)
- Contaminated stencil underside (clean every 10-15 prints)
Q5. Why does solder paste height vary across the PCB?
- Uneven stencil tension (should be >35N/cm²)
- PCB support pins improperly positioned (use 1 pin per 100cm²)
- Squeegee blade angle deviation (maintain 60±5°)
- Solder paste slump (keep paste temperature <26°C)
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