First of all, the use of a temperature curve tester is the key to controlling the process during the entire reflow furnace operation. Without a temperature curve tester, you will not know whether the furnace is functioning properly, whether it needs calibration, etc.
Secondly, the temperature curve tester plays a key role in helping manufacturers to verify and solder all circuit board components under standardized operations to ensure high-reliability and low-loss production. For example: the highest melting point of some components is 240C; if there is no temperature curve tester, how can you know whether the current state you set meets the melting point requirements of these components.
Thirdly, having a temperature tester can reduce production loss and analyze production loss to avoid its recurrence. The direct causes that affect the quality of soldering are the rising slope, immersion tin temperature, wetting time, melting tin time, average temperature and other reflow furnace parameters. Without a temperature profile tester, you cannot accurately measure these important characteristics in the reflow furnace process.
Finally, when you introduce new circuit boards into different thermal processes, they need to fine-tune the parameters of the reflow furnace (zero calibration and chain speed settings) to ensure that the soldering meets the performance parameters of the components and the solder paste itself .
SMT reflow soldering is one of the main key equipment for surface mount process production, and its correct use is undoubtedly to further ensure the quality of soldering and product quality. In the use of reflow soldering, the most difficult to grasp is the setting of the temperature profile of reflow soldering. How to set the temperature curve of reflow soldering more reasonably?
To solve this problem, we must first understand the working principle of reflow soldering.Analyze the principle of reflow soldering from the temperature curve (see Figure 1-1):When the PCB enters the heating zone (dry zone), the solvent and gas in the solder paste evaporate, At the same time, the flux in the solder paste wets the pads, component ends and pins, and the solder paste softens, collapses, and covers the pads. The component ends and pins are isolated from oxygen -->When the PCB enters the heat preservation area, the PCB and components are fully preheated to prevent the PCB from suddenly entering the welding high temperature area and damaging the PCB and components --> When the PCB enters the soldering area, the temperature rises rapidly to make the solder paste reach a molten state, and the liquid solder wets, diffuses, diffuses, or reflow to the PCB pads, component ends and pins to form solder joints --> The PCB enters the cooling zone and solidifies the solder joints. At this time, the soldering process of the reflow oven is completed.
In the field of SMT electronics manufacturing, "stable quality, efficient automation, and solder joint reliability" are always hot topics. But with the wave of German Industry 4.0 and the introduction of themes such as intelligent interconnection, SMT factories are in a hurry, and more and more users are pursuing blindly. Of course, there is no lack of them: Huawei, ZTE and other leading representative companies have been at the forefront of the times, exploring the integration of intelligence, IoT, high-speed transmission, and big data, and tirelessly exploring the ultimate goal of an unmanned chemical factory.