SMT factory inspection equipment is very important, inspection equipment will be directly related to the shipment of product quality, excellent quality inspection equipment can be found in the processing process in a timely manner there are quality problems with the product and timely solution. What testing equipment is needed in the production process of SMT SMD processing?
SMT factory in the common detection equipment are: SPI, AOI, X-RAY, ICT
I. SPI detection
SPI (solder paste detector) in the SMT chip processing is generally placed after the solder paste printing process, mainly used to detect the thickness of the paste on the circuit board, area, offset, etc., is to monitor the quality of the printing of the solder paste is an important piece of equipment.
AOI (Optical Inspection Instrument) in the SMT factory placed in many locations, but in the actual processing is generally placed in the back of the reflow soldering, used for reflow soldering after the PCBA welding quality inspection, so as to timely detection and elimination of the less tin, less material, false soldering, even tin and other defects.
III. X-RAY detection
X-RAY is in fact a common hospital X-ray, it is the use of high voltage impact target X-ray penetration to detect electronic components, semiconductor packaging products, the quality of the internal structure, as well as various types of SMT soldering quality of the soldering joints X-RAY can detect all the soldering joints on the circuit board, including the naked eye can not see the soldering joints, such as the BGA. In addition, the X-RAY detector can detect In addition, the X-RAY detector can detect defects such as bridges, voids, oversized solder joints, undersized solder joints and other defects after soldering.
IV. ICT Inspection
ICT oriented production process control, can measure resistance, capacitance, inductance, integrated circuits. It is particularly effective for detecting open circuits, short circuits, component damage, etc., fault location is accurate and easy to repair. Can test the welding of false soldering, open circuit, short circuit, component failure, with the wrong material, etc.
Features of NeoDen SMT SPI machine
Software System
Operation system: Windows 7 Ultimate 64bit
1) Idetification system
Feature: 3D raster camera (double is optional)
Operate interface: Graphical programming, easy to operate, Chinese and English system switch over
Interface: 2D AND and 3D truecolor image
MARK: Can choose 2 commom mark point
2) Programe
Support gerber, CAD input, offline and manual program
3) SPC
Offline SPC: Support
SPC Report: Anytime Report
Control Graphic: Volume, area, height, offset
Export content: Excel, image (jpg, bmp)