SMT process materials include solder, solder paste, adhesive and other reflow oven welding and SMT machine materials, as well as flux, cleaning agent, heat transfer media and other process materials.
1. Good stability and good reliability. Strict control of harmful impurities in solder. Soldering paste and flux requirements of low residue, non corrosive. The bonding strength of the binder is not high or low, so as to ensure that the early welding process does not drop the piece, but also in maintenance is convenient to take off the piece and so on.
2. It can meet the needs of high speed production. SMT production process is generally a high-speed automatic process, and the process materials should be adapted to it.
3. Can meet the needs of fine pin spacing and high density assembly. Fine pin spacing and high density assembly require finer powder size of alloy solder in solder paste. The solder paste and binder are required to have better thixotropy and smaller collapse.
The solid content and activity in flux should be strictly controlled to avoid bad phenomena such as bridging.
4. It can meet the requirements of environmental protection. Many materials in traditional SMT process contain harmful substances to ozone layer and human body, such as chlorinated fluorine cleaning agent and lead solder. With the increasing awareness of environmental protection and increasing attention to human health, the research work of harmless SMT process materials is being strengthened.
The current solder is divided into two kinds according to the amount of lead and lead, solder has been gradually replaced by lead-free solder.
Lead-free solder is characterized by reducing the harm of lead to human living environment, high melting point, superior tensile strength, strong fatigue resistance, and the thermal stability of flux and welding process and equipment requirements
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