SMT stands for Surface Mount Technology and is the most popular technology and process in the electronics assembly industry.
SMT AOI machine stands for Automatic Organic Inspection, also known as automatic optical inspection. It uses high speed and accurate vision processing technology to detect various mis-assembly and solder defects on PCBs.
SPI stands for Solder paste Inspection, also known as solder paste inspection. It is the inspection and verification and control of solder paste quality for the printing process.
1. Quality control: cover some defects that cannot be detected manually, including (original part offset, component less tin, solder joint short circuit, component reverse, component misload, component deformation, component leakage, component erection.)
2. Process control: real-time generation of statistical charts, the type of failure, frequency and other information real-time feedback to the production department, so that the production department in a timely manner to find the production process and correct the problem in a timely manner. As soon as possible, in order to minimize the loss of time and materials.
3. Process parameters and other verification: For a new special processing veneer, from printing process parameters to reflow process parameters, all need to be carefully modulated, whether the setting of these parameters is reasonable, ultimately depends on the quality of the solder, this process must be tested several times to achieve. AOI provides an effective means to verify the test results.
SPI is used after the printing machine for quality inspection of solder printing and verification and control of the printing process. SPI plays a considerable role in the overall SMT. And AOI is divided into two kinds of furnace before and after the furnace, the former for device placement inspection, the latter for the detection of solder joints.
The two functions are different, SPI inspection solder paste printing, AOI in the furnace before the inspection of the stability of the cracked parts, in the furnace after the inspection of the solder quality, etc..
Software system:
Operation system: Windows 7 Ultimate 64bit
1) Idetification system:
Feature: 3D raster camera(double is optional)
Operate interface:
Graphical programming, easy to operate, Chinese and English system switch over
Interface: 2D AND and 3D truecolor image
MARK: Can choose 2 commom mark point
2) Programe:Support gerber, CAD input, offline and manual program
3) SPC
Offline SPC: Support
SPC Report: Anytime Report
Control Graphic: Volume, area, height, offset
Export content: Excel, image (jpg,bmp)
Inspection Items:
1) Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc.
2) Component defect: missing or excessive component, misalignment, uneven, edging, opposite mounting, wrong or bad component etc.
3) DIP: Missing parts, damage parts, offset, skew, inversion, etc
4) Soldering defect: excessive or missing solder, empty soldering, bridging, solder ball, IC NG ,copper stain etc.
Calculation Method: Machine learning, color calculation, color extraction, gray scale operation, image contrast.
Inspection mode: PCB fully covered, with array and bad marking function.
SPC statistics function: Fully record the test data and make analysis, with high flexibility to check production and quality status.
Minimum component: 0201 chip, 0.3 pitch IC.
Optical system:
Camera: 5 million pix full color high speed industrial digital camera ,20 million pix camera optional.
Lens resolution: 10um/15um/18um/20um/25um, can be custom-made.
Lighting source Annular stereo multi-channel color light, RGB/RGBW/RGBR/RWBR optional.
