BGA is a high precision IC component in smt chip processing industry, the price is relatively expensive, belongs to the active chip, so for the mounting process and technical requirements are very high. If the bga mounting a large number of quality problems, then it will cause serious cost waste!
Usually BGA even tin is a common quality problem of welding, even tin is usually called short circuit, the surface of the bga below the tin ball and the tin ball in the welding process occurs in connection, resulting in pads connected and cause short circuit.
Caused by the bga chip even tin common reasons are as follows
1) PCB (pad) is not flat
pcb pad pad is not flat, resulting in tin ball height is not the same, the patch compression depth is not the same, resulting in a short circuit even tin
2) the amount of solder paste printing is too thick
pad pad solder paste printing more than too thick, resulting in the reflow soldering, solder paste hot melt after the tin ball and the tin ball connected to the tin ball, resulting in even tin short-circuit, which is bga even tin the most reasons for happening
3) PCB pad with foreign objects
This is similar to the pcb pad uneven, due to foreign matter above the pad, resulting in deviations in the amount of solder paste printing and pasting deviations, resulting in solder paste hot melt between the neighbouring tin ball even tin
4) Mounting offset
bga belongs to the high-precision ic, the distance between the tin ball is less than 1uM have, so the placement machine in the mounting bga need to be high precision mounting, if there is a tin ball and pad bit difference, it is easy to cause the tin ball connected to the tin, which is the main reason for the occurrence of bga even tin.
The above situation is the occurrence of bga even tin some common reasons, bga welding quality testing, the best need to use x-ray view, so that a better detection of bga welding quality.

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