1. Before production, when the solder paste mixer is used to stir the solder paste to make it even, the operator shall regularly spot test the solder paste viscosity with a viscosity tester or qualitative test.
2. In the production process, the printing quality of solder paste shall be 100% inspected, and the main contents shall be whether the solder paste graphics are complete, whether the thickness is uniform, and whether there is solder paste pointing phenomenon.
3. After the printing experiment or printing failure, the solder paste on the printed board shall be thoroughly cleaned and dried with an PCB cleaning machine to prevent solder balls from appearing after reflow due to solder paste residue on the board during reuse.
4. The solder paste should be strictly used within the validity period. The solder paste should be kept in the refrigerator on normal days and should be kept at room temperature for more than 6 hours before use.
5. After the first printing plate or equipment is adjusted, the solder paste thickness tester shall be used to measure the printing thickness of solder paste. The test points shall be selected at 5 points on the PCB test surface, such as the upper and lower, the left and the right, and the middle, and the value shall be recorded.
6. Cleaning the template according to the process requirements after the work on shift is completed.
