Nowadays, SMT (surface mount) technology cannot be separated from the important auxiliary material is solder paste, which plays an important role in the rapid development of chip processing technology.
The role of solder paste
Tin paste, as the name suggests, is a paste-like substance, somewhat similar to our toothpaste, its role is through the solder paste printing machine will be printed to the pcb pad leakage above, in the mounting of components to play a sticky role in preventing the mounting of components and transmission of vibration and lead to the components off position or fall. In the reflow soldering when the first hot melt so that the parts of the soldering feet climb tin and then cooled solidification, the components will be fixed in the pad above, so as to achieve the electronic product circuit signal transmission.
Composition of solder paste
Solder paste includes tin powder metal particles and flux, of which the tin powder metal particles have coarse and fine points, generally in accordance with the coarse and fine points 1-5, the larger the number, representing the tin powder particles, the smaller, of course, the more expensive the price will be. The flux contains resin rosin, active agent, thickener and solvent, the reason why the paste is similar to paste, is containing thickening agent, the purpose is to paste printed on the top of the pcb pad does not collapse, while the solvent is to maintain the wettability of the paste, the active agent is in order to weld when cleaning the pcb and component pins of the oxides, to maintain a better weldability.
Use of solder paste
Solder paste is generally stored in the refrigerator, the need to return to temperature before use, return to temperature also need to be stirred, probably with a stick to lift up the paste can have a vertical natural flow and continuous flow can be.
Features of NeoDen ND1 stencil printer
PCB parameters
Max. plate size (X x Y) 450mm x 350mm
Minimum plate size (Y x X) 50mm x 50mm
PCB thickness 0.6mm ~ 14mm
Warping quantity Max. PCB diagonal 1%
Max. plate weight 10KG
Plate edge clearance Configuration to 3mm
Maximum bottom clearance 20mm
Transmission speed 1500mm /second(Max)
Transfer height from the ground 900 ±40mm
Transfer track direction Left – Right, Right – Left, Left – Left, Right - Right
Transmission mode Section-type track
PCB clamp mode
Software adjustable pressure of the elastic side pressure
