In the process of designing hardware circuits, mistakes are inevitable. Here is a list of the five most common design problems in PCB design and the corresponding countermeasures.
1. Pin error
Series linear regulated power supplies are cheaper than switching power supplies, but they are less efficient at converting electrical energy. Often, given the ease of use and low cost, many engineers choose to use linear regulated power supplies.
However, it should be noted that although it is easy to use, it consumes a lot of power and causes a lot of heat to spread. In contrast, switching power supplies are complex in design but more efficient.
However, it should be noted that the output pins of some regulated power supplies may not be compatible with each other, so you need to confirm the relevant pin definitions in the chip manual before wiring.
2. Wiring errors
Comparative differences between design and wiring are the main cause of errors in the final stages of PCB design. So a number of things need to be double checked.
For example, device size, quality of vias, pad size and level of review. In short it needs to be double checked against the design schematic.
3. Corrosion traps
A corrosion trap can be formed when the angle between the PCB leads is too small (acute angle).
These sharp angles can be trapped during the corrosion phase of the circuit board and can result in more copper being removed from the copper deposit there, thus forming a snag or trap.
Later on, the leads may break off, creating an open circuit. Modern production processes due to the use of light-sensitive corrosion solution, this corrosion trap phenomenon has been greatly reduced.
4. Lite-monument devices
When soldering small surface-mounted devices using the reflow process, the device will be infiltrated by the solder to form a single-ended warp, commonly known as a "monolith".
This phenomenon is often caused by asymmetrical wiring patterns, resulting in uneven heat dispersion across the device pads. Using the correct DFM inspection can help to alleviate this phenomenon.
5. Lead width
When the current of PCB leads exceeds 500mA, the PCB first wire diameter will appear to be under capacity. With the usual thickness and width, the PCB surface leads pass more current than the internal leads of a multilayer circuit board. This is because the surface leads can diffuse heat through air flow.
The wire width is also related to the thickness of the copper foil on the layer in which it is located. Most PCB manufacturers allow you to choose from copper foil thicknesses ranging from 0.5 oz/sq.ft to 2.5 oz/sq.ft.
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