There are many micro, precision electronic components in SMT chip processing. For the welding reliability of the product, it is difficult to judge its quality with the naked eye. Therefore, the SMT chip processing industry to set up IQC department, strict control of incoming material inspection. Prevent the production process or finished product batch defects, as SMT SMD processing, we should know what the definition of IQC inspection defects. what are the contents of the IQC inspection, we must clearly understand! The following for you to explain the IQC incoming inspection specification process.
I. SMT SMD processing defect definition:
First of all, we need to be clear about the SMT SMD processing industry IQC incoming inspection of defects in the definition of what, so that we can better, reasonable, standardised, acceptance of materials.
1. CR (fatal defects): refers to the existence of products that may lead to personal accidental injury to the producer or user, or property damage that may cause customer complaints, as well as violations of laws and regulations and environmental regulations. (safety/environmental protection, etc.)
2. MA (major defect): A feature of the product that does not meet the specified requirements (structural or functional) or a serious cosmetic defect.
3. MI (Minor Defect): The product has some defects that do not affect the function and applicability. (Generally refers to minor defects in appearance).
II. SMT chip processing IQC incoming inspection content
As SMT SMD processing general production cycle is shorter, the incoming material has been the corresponding material performance test, then we should focus on testing the consistency of the material and the BOM table, pad oxidation, transport is damaged and other content. Usually includes material identification and BOM table consistency, whether the appearance of discolouration and black, whether the welding end of the oxidation, IC pin damage, whether the deformation, whether there are traces of rupture, whether the expiry date and other content.
1. Check whether the PCB type and BOM requirements are consistent, whether the pad oxidation discolouration, green oil is intact, whether the printing is clear, whether it is flat, whether the corners are bumped phenomenon.
2. SMT chip processing resistor inspection specifications size, resistance, error value and BOM table requirements. Inspection disc marking value and component body silkscreen word is consistent, if there is no silkscreen word need to use the LCR bridge to test the resistance value. Check whether the weld end is oxidised and whether the body is damaged.
3. SMT chip processing capacitor inspection specifications size, capacitance, error, withstand voltage is consistent with the requirements of the BOM table. Inspection disc identification value and component body silkscreen word is consistent, if the bulk material also need to use the LCR bridge to test the capacitance value is consistent with the logo. Check whether the welding end is oxidised and whether the body is damaged.
4. SMT chip processing inductor inspection specifications size, sense value, error and BOM table requirements are consistent. Check the disc logo value and the component body silkscreen word is consistent, if there is no silkscreen word need to use the LCR bridge to test the inductance value. Check whether the welding end is oxidised, whether the body is broken.
5. Diode, transistor test specifications size, identification and BOM table requirements are consistent. Check whether the marking on the body of the word code and the label to correspond. Check whether the welding end is oxidised, whether the body is damaged.
6. IC, BGA components test specifications size, identification and BOM table requirements are consistent. Peak inspection of the body on the marking of the word code with the label to correspond to. Inspection pins, solder balls whether oxidation, pin deformation.
7. Connectors, buttons and other components to check whether the specification size and BOM table requirements are consistent. Check whether the welding end is oxidised, whether the body is deformed. Check whether the temperature resistance reaches the reflow soldering requirements.
Zhejiang NeoDen Technology Co., LTD., founded in 2010, is a professional manufacturer specialized in SMT pick and place machine, reflow oven, stencil printing machine, SMT production line and other SMT Products. We have our own R & D team and own factory, taking advantage of our own rich experienced R&D, well trained production, won great reputation from the world wide customers.
In this decade, we independently developed NeoDen4, NeoDen IN6, NeoDen K1830, NeoDen FP2636 and other SMT products, which sold well all over the world. So far, we have sold more than 10,000pcs machines and exported them to over 130 countries around the world, establishing a good reputation in the market. In our global Ecosystem, we collaborate with our best partner to deliver a more closing sales service, high professional and efficient technical support.