In the SMT process, if the printing deviation of the solder paste printing machine occurs, it is very likely to cause a large number of tin, affecting the quality of the finished product and causing economic losses.
I. The main reasons for the deviation of solder paste printer printing
1. If the positioning point is not identified accurately, it will cause the deviation of solder paste printing.
2. Because the coordinates are not right, resulting in the offset of solder paste printing, need to adjust the coordinate position.
3. If the camera touches the PCB resulting in solder paste printing offset, the camera cover must be locked in the system.
4. The stencil is fixed loosely.
5. CB board is not clamped, loose offset during printing.
6. Loose wires, unstable connection.
II. Solve the SMT solder paste printing offset methods
1. You can use image processing technology to check the recognition effect of MARK points to see whether the recognition center is accurately positioned in the center of the MARK points, scoring a high score, generally more than 500 points.
2. Check the width of the conveyor belt. The width of the track should not be too wide. If it is too wide, the PCB can not be clamped, and it will cause looseness in the printing process, resulting in printing offset.
3. Check whether the laser stencil is fixed or not, you can try to push it gently.
4. Check if the BACKUPPIN system or top PIN is installed correctly. If not, you can remove all top PINs and reinstall them.
5. Whether the PCB thickness setting is appropriate and meets the requirement.
6. Check if the stencil guiding system clamping device is normal.
7. Check whether the connecting wire between nextmovecard and control box is loose or damaged, reconnect or replace the connecting wire according to the situation.
8. Check whether the front bearing of the motor is worn or defective, and replace it in time if there is any abnormality.
9. Check if there is any abnormality in the system software or hard disk.
Features of NeoDen ND1 SMT solder paste screen printer machine
Description
Transmission mode Section-type track
PCB clamp mode
Software adjustable pressure of the elastic side pressure
Specification
| Product name | ND1 Full Automatic Stencil Printer | Board margin gap | 20mm |
| Maximum board size(X x Y) | 450mm x 350mm | Transfer height from the ground | 900±40mm |
| Minimum board size(X x Y) | 50mm x 50mm | Transfer speed | 1500mm/s(Max) |
| PCB thickness | 0.6mm~14mm | Transfer orbit direction | L-R, R-L, L-L, R-R |
| Warpage | 1% Diagonal | Machine weight | Appro. 1000Kg |
| Maximum board weight | 10Kg | Board margin gap | Configuration to 3mm |