How To Choose A Wave Soldering Machine?

For electronics manufacturers that need to solder through-hole components (THT), wave soldering machines are a critical piece of equipment in PCB assembly production. Whether dealing with mixed SMT and THT assembly or PCB production dominated by through-hole components, selecting the right wave soldering machine impacts production processes, process compatibility, and equipment investment.

However, when faced with wave soldering machines of different specifications, procurement personnel often encounter several questions: What parameters should be used to select a wave soldering machine? Is a larger maximum PCB width always better? What is the difference between dual-wave and single-wave soldering machines? Does a faster conveyor speed always mean higher production capacity?

This article will explain how to select a wave soldering machine that meets your specific production needs by examining PCB specifications, soldering processes, equipment parameters, production requirements, and procurement considerations, using the NeoDen ND250 wave soldering machine as a reference.

Wave soldering is primarily used for through-hole component soldering but can also be applied to certain products that combine SMT and THT assembly. The equipment uses a conveyor system to feed the PCB through the flux spraying, preheating, and soldering zones to complete the corresponding soldering process.

For PCBs containing a large number of through-hole components, wave soldering machine is one of the most common automated soldering methods.

For example, when a PCB is populated with connectors, sockets, switches, or other through-hole components, wave soldering can be used to solder these components. Buyers should select equipment based on component layout, board size, and production cycle time.

Some PCBs contain both surface-mount components and through-hole components. For such products, it may be necessary to first solder the surface-mount components using reflow soldering, followed by soldering specific through-hole components using wave soldering machine.

Therefore, when procuring wave soldering machine, planning must take the entire PCB assembly process into account, rather than considering a single soldering step in isolation.

PCB specifications form the basis for selecting wave soldering equipment. The equipment's conveyor width, structure, and process adaptability must all match the actual products.

When purchasing, first confirm the maximum PCB width and length used in production, and verify the equipment's maximum processing specifications. If the equipment's maximum PCB width cannot meet the actual product requirements, it may limit the scope of production applications.

For example, the NeoDen ND250 wave soldering machine has a maximum PCB width of 250 mm. Buyers should first confirm whether existing and planned PCBs fall within this range before further evaluating the equipment's suitability.

In addition to dimensions, attention should be paid to PCB thickness, weight, shape, and board structure.

Different PCBs may have varying process requirements during conveyance and soldering. For multilayer boards, larger boards, or PCBs with special structures, it is recommended to provide relevant product parameters to the supplier before purchasing the equipment to confirm whether it can meet actual production needs.

If the PCB contains large connectors, densely packed through-hole components, or a special component layout, the equipment configuration must be evaluated in conjunction with the actual soldering process.

Equipment specifications and product processes should be mutually compatible. Purchasers should not base their decisions solely on equipment names or maximum processing dimensions; instead, they should conduct process validation using actual PCB products whenever possible.

Equipment conveyance speed is a key parameter to consider during selection, but conveyance speed does not equate to actual production capacity.

The actual production cycle time for wave soldering is also influenced by factors such as PCB size, component layout, preheating conditions, soldering processes, and the efficiency of preceding and subsequent processes.

Before purchasing, compile the following information:

Planned daily PCB production volume
PCB dimensions and product types
Working hours per shift
Production cycle times of preceding and subsequent processes
Whether support for high-mix, low-volume production is required

This information helps suppliers evaluate equipment specifications and production line integration requirements.

The conveyor speed affects the time it takes for a PCB to pass through the preheating and soldering zones; therefore, it must be matched to actual process conditions.

The NeoDen ND250 wave soldering machine has a conveyor speed range of 0–1.2 m/min. This parameter can serve as a reference for purchasers when evaluating equipment specifications.

It is important to note that conveyor speed alone cannot determine whether the equipment can meet a specific production output. The actual production cycle time should be evaluated in conjunction with the PCB product and soldering process.

For high-variety, small-batch production, equipment selection should focus on changeovers between different PCB products and process adaptability.

For continuous production, further consideration should be given to matching the equipment's cycle time with that of the entire production line, as well as equipment operation, maintenance, and production management requirements.

Therefore, when selecting a wave soldering machine, the decision should be based on actual products and production plans, rather than simply pursuing higher speed parameters.

The preheating system is a critical component of wave soldering equipment selection. Before a PCB enters the soldering zone, it must undergo a preheating phase, and the temperature profile during this phase must align with the soldering process requirements.

Insufficient or excessive preheating can both affect process performance. Actual preheating conditions must be adjusted based on PCB structure, component types, flux specifications, and solder conditions. Relevant soldering guidelines also emphasize that parameters such as preheating, conveyor speed, and soldering time should be optimized based on specific products and materials.

When purchasing, consider the following:

Length of the preheating zone
Preheating temperature range
Preheating method
Whether the equipment allows for easy adjustment of process parameters

The suitability of a machine for a particular PCB cannot be determined solely by the length of the preheating section. More importantly, the equipment must be capable of meeting the process requirements of the actual product.

According to the NeoDen ND250 product documentation, this equipment features an 800mm, two-stage preheating configuration with a preheating temperature range from room temperature to 180°C.

Purchasers can compare these parameters with their own PCB products, flux, and process requirements, and further confirm actual compatibility with the supplier.

Wave soldering equipment can utilize different wave configurations. When purchasing, the selection should be based on the PCB product and soldering process, rather than simply assuming that more waves are better.

A single-wave configuration completes the soldering process using a single soldering wave. Its suitability must be evaluated in conjunction with PCB design, component types, and process requirements.

Dual-wave soldering uses two distinct waves to complete the soldering process. In common dual-wave processes, the first wave primarily helps the solder wet the pads and component leads, while the second wave is used to further remove excess solder and reduce the risk of bridging.

However, the final soldering result still depends on the PCB design, flux, solder, conveyor speed, and actual process parameters; it cannot be determined solely by the wave structure.

Purchasers should evaluate the following factors:

PCB component layout
Types of through-hole components
Soldering process requirements
PCB design and board structure
Production scale and equipment budget

The NeoDen ND250 features a dual-wave structure and can serve as a product reference for users evaluating dual-wave soldering equipment.

Wave soldering machine involves multiple process parameters, including preheat temperature, solder temperature, conveyor speed, and wave height. The equipment control system should allow operators to easily set and manage these parameters.

Purchasers should pay attention to the temperature control method used by the equipment and whether it can meet their process adjustment and daily operational needs.

The temperature control configuration alone does not guarantee a specific soldering quality. The actual soldering process still requires validation using PCB products and corresponding materials.

The PLC control system and touchscreen interface facilitate equipment operation and parameter configuration. When purchasing, it is advisable to understand the equipment's control system configuration, operating methods, and maintenance requirements.

According to product documentation, the NeoDen ND250 employs PID+SSR temperature control and is equipped with a Mitsubishi PLC and a touchscreen.

This information can serve as part of a comparison of equipment specifications. Purchasers should also evaluate these features in light of their own production management and process requirements.

Wave soldering and reflow soldering are two common soldering methods in PCB assembly, but their process applications differ.

Reflow soldering is commonly used for soldering surface-mount components. The equipment heats the solder paste to melt the solder, thereby forming solder joints.

Wave soldering is commonly used for through-hole component soldering and can also be used for certain mixed-assembly PCB products.

If a PCB product contains both surface-mount components and through-hole components requiring wave soldering, the production line may need to combine both types of equipment to complete the different soldering processes.

The specific equipment configuration depends on the product design and process flow. Purchasers should first analyze the actual PCB assembly process before determining equipment requirements.

In addition to technical specifications, purchasers should also consider aspects such as equipment installation, operation, maintenance, and supplier support.

Before purchasing, it is necessary to confirm the equipment dimensions, installation space, PCB conveyance direction, and requirements for integration with preceding and subsequent processes.

According to the NeoDen ND250 product specifications, the equipment dimensions are 1800 × 1200 × 1500 mm. Users can use these dimensions as a reference for evaluating equipment layout and further verify on-site installation conditions.

It is recommended to familiarize yourself with the equipment's daily operation, cleaning and maintenance procedures, and related consumable requirements before purchasing, and to confirm whether operators need to undergo training.

For SMT factories and electronics manufacturing companies, equipment procurement involves more than just purchasing a machine; it also requires consideration of subsequent installation and commissioning, operator training, spare parts supply, and technical support.

Therefore, when selecting a wave soldering supplier, a comprehensive evaluation should be conducted based on equipment configuration, service offerings, and actual production needs.

After understanding the key factors in selecting a wave soldering machine, purchasers can conduct a further evaluation based on specific equipment parameters.

The NeoDen ND250 is a wave soldering machine featuring a dual-wave configuration. The following parameters are taken from previously provided product documentation:

Parameter	NeoDen ND250
Wave Configuration	Dual-wave
Maximum PCB Width	250 mm
Preheating Configuration	800 mm, two-stage preheating
Preheating Temperature Range	Room temperature to 180°C
Wave Height	12 mm
Conveyor Speed	0–1.2 m/min
Solder Pot Capacity	200 kg
Solder Pot Power	6 kW
Temperature Control	PID+SSR
Equipment Control	Mitsubishi PLC + Touchscreen
Equipment Dimensions	1800 × 1200 × 1500 mm

These specifications can help purchasers make an initial assessment of whether the equipment meets their specific needs.

If you are looking for wave soldering equipment suitable for PCB through-hole soldering or mixed assembly processes, we recommend consulting with equipment suppliers to confirm compatibility based on actual PCB dimensions, component types, soldering processes, and production cycle times.

There is no single parameter that applies to all production scenarios. PCB dimensions, soldering processes, preheating configurations, conveyor speed, and the equipment's control system all require comprehensive evaluation.

The selection should be based on the maximum PCB width of current and planned production, in conjunction with equipment specifications and confirmation from the supplier.

Not necessarily. The wave configuration should be selected based on PCB design, component types, and actual soldering processes.

Can wave soldering and reflow soldering be used on the same production line?

This can be planned according to the PCB product's assembly process. Whether both types of equipment need to be configured simultaneously depends on the product's component types and process route.

It is recommended to prepare information such as PCB dimensions, thickness, component types, expected production volume, soldering process, production line layout, and available installation space in the factory.

When selecting a wave soldering machine, one should not rely solely on comparing equipment prices or individual technical specifications. More importantly, the equipment specifications must align with the PCB product, soldering process, production plan, and on-site layout.

If you are planning a PCB assembly production line or would like to learn more about the NeoDen ND250 wave soldering machine, please contact NeoDen and provide your PCB specifications, soldering requirements, and production plan so we can further discuss equipment selection.