Solder paste is a new type of soldering material that came into being along with SMT, mainly used in the reflow oven soldering of electronic components such as resistors, capacitors, ICs and other electronic components on the surface of the pcb processing surface of the SMT SMD processing industry. Solder paste according to its viscosity, fluidity and the type of printing leakage board design formula, usually can be categorized according to the following properties:
1. Classified according to the melting point of the alloy solder. Solder pastes are categorized by melting point into high-temperature solder pastes (above 217°C), medium-temperature solder pastes (173~200°C) and low-temperature solder pastes (138~173°C). The most commonly used solder paste melting point of 178 ~ 183 ℃, with the use of different types of metals and composition, the melting point of the solder paste can be increased to more than 250 ℃, can also be reduced to 150 ℃ or less, according to the different temperatures required to weld, the choice of different melting point of the solder paste.
2. According to the flux activity classification. Solder paste according to the flux activity can be divided into R level (inactive), RMA level (moderate activity), RA level (fully active) and SRA level (super active). Generally R grade is used for aerospace, avionics welding, RMA grade is used for military and other high-reliability circuit components, RA grade and SRA grade is used for consumer electronics products, use can be selected according to the situation of PCB and components and cleaning process requirements.
3. Classified according to the viscosity of the solder paste. Solder paste viscosity varies greatly, usually 100~600Pa-s, up to 1000Pa-s or more. The use of time can be based on the different means of applying the paste process to choose.
4. According to the cleaning mode classification. Solder paste according to the cleaning method can be divided into organic solvent cleaning class, water cleaning class, half-water cleaning class and no cleaning class several kinds. Among them, organic solvent cleaning class such as the traditional rosin solder paste, water cleaning class is more active, can be used with difficult brazing surface, half-water cleaning class and cleaning class is the direction of the development of electronic product technology.
Features of NeoDen IN6 Reflow Oven
1. Full convection, excellent soldering performance.
2. 6 zones design, light and compact.
3. Smart control with high sensitivity temperature sensor, the temperature can be stabilized within + 0.2℃.
4. Original high-performance aluminum alloy heating plate instead of heating pipe, both energy-saving and high-efficient, and transverse temperature difference is less than 2℃.
5. Original built-in soldering smoke filtering system, elegant appearance and eco-friendly.
6. Several working files can be stored, freely switch between Celsius and Fahrenheit, flexible and easy to understand.
7. Japan NSK hot-air motor bearings and Swiss heating wire, durable and stable.
8. Reinforced heavy-duty carton package, light-weight and environment-friendly.