The use of BGA rework station can be roughly divided into three steps: desoldering, mounting, welding.
I. Desoldering
1. The preparatory work for rework. BGA chips to be reworked to determine the use of the nozzle suction nozzle. According to the customer's use of leaded and lead-free soldering to determine the temperature of rework high and low, because the melting point of leaded tin balls in general at 183 ℃, while the melting point of lead-free tin balls in general at about 217 ℃. Fix the PCB motherboard on the BGA rework platform, laser red dot positioning in the center of the BGA chip, the mounting head down to determine the mounting height.
2. Set up the desoldering temperature, and store it so that it can be directly called when reworked in the future. In general, the temperature of desoldering and welding can be set to the same group.
3. in the touch screen interface to switch to the removal mode, click the rework button, the heating head will automatically come down to the BGA chip heating.
4. The temperature to go through the first five seconds, the machine will alarm prompts, hair drip drip sound. When the temperature curve is finished, the suction nozzle will automatically suck up the BGA chip, and then the mounting head will suck the BGA up to the initial position. The operator can connect the BGA chip with the material box, and the desoldering is completed.
II. Mounting welding
1. after the completion of tin removal on the pad, use a new BGA chip, or after planting the ball BGA chip. Fixed PCB motherboard. The BGA will be welded to be placed roughly placed in the position of the pad.
2. Switch to the mounting mode, click the start button, the mounting head will move down, the suction nozzle automatically suck up the BGA chip to the initial position.
3. Open the optical alignment lens, adjust the micrometer, X-axis Y-axis PCB board back and forth, right and left adjustment, R angle adjustment of the angle of the BGA. BGA on the ball (blue) and the pad on the solder joints (yellow) can be presented in different colors on the display. After adjusting until the solder balls and solder joints completely coincide, click the "Alignment Complete" button on the touch screen.
The mounting head will automatically drop, put the BGA on the pad, automatically turn off the vacuum, and then the mouth suction will automatically rise 2~3mm, and then heating. When the temperature curve is finished, the heating head will automatically rise to the initial position, welding is complete.
III. Plus welding
This function is aimed at some of the front because of the low temperature, resulting in poor welding BGA, where it can be heated again.
1. The PCB board is fixed on the rework platform, the laser red dot positioned in the center of the BGA chip.
2. Call the temperature, switch to the welding mode, click start, at this time the heating head will automatically drop, after contacting the BGA chip, it will automatically rise 2~3mm to stop, and then heating.
After the temperature curve is finished, the heating head will automatically rise to the initial position.
From the whole structure, all the BGA rework station are basically similar. Each model of optical BGA rework station has its own advantages and features.
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