The process of SMT chip processing is tedious and complex, in each process of production there may be problems, in order to ensure the quality of the product, timely detection of problems, it is necessary to use a variety of testing equipment to detect quality defects. So what are the common equipment detection in the SMD processing?
1. MVI manual visual inspection
Employees wearing anti-static clothing, anti-static wrist and gloves, hands holding the PCBA from top to bottom, from left to right to gradually scan to observe whether there is skew, leakage and other bad welding situation. Multiple visual inspection of key parts, and make relevant records.
2. AOI inspection equipment
AOI that is, automatic optical inspection instrument, in the SMD processing AOI detection can detect the reflow after the wrong parts, leakage, pole reverse, false welding, empty welding, false welding, short circuit, offset, standing monument and other welding defects, can also detect the appearance of PCBA solder joints more tin, less tin, even tin and other undesirable phenomena.
X-RAY inspection equipment is a very useful tool that can be used to detect and verify the soldering and assembly process of electronic components, thus improving product quality and reliability. to help quality control personnel to carry out comprehensive monitoring and evaluation of the bonder process and to identify and resolve potential problems to ensure product consistency and stability.
Features of NeoDen AOI machine
Inspection system Application: After stencil printing, pre/post reflow oven, pre/post wave soldering, FPC etc.
Program mode: Manual programming, auto programming, CAD data importing
Inspection Items
Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc.
Component defect: missing or excessive component, misalignment, uneven, edging, opposite mounting, wrong or bad component etc.
DIP: Missing parts, damage parts, offset, skew, inversion, etc
Soldering defect: excessive or missing solder, empty soldering, bridging, solder ball, IC NG ,copper stain etc.
Calculation Method: Machine learning, color calculation, color extraction, gray scale operation, image contrast.
Inspection mode: PCB fully covered, with array and bad marking function.
SPC statistics function: Fully record the test data and make analysis, with high flexibility to check production and quality status.
Minimum component: 0201 chip, 0.3 pitch IC.