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What Is The Main Process Of PCBA Testing?

Apr 11, 2022

PCBA testing is generally based on the customer's test program to develop a specific test process, the general basic PCBA testing process is as follows.

Program burn-in → ICT test → FCT test → aging test 

1. Program burn-in

PCBA board after the completion of the welding process, engineers can PCBA board in the microcontroller program burn-in, so that the microcontroller can achieve specific functions.

2. ICT test

ICT test is mainly through the test probe contact PCBA test points, to achieve the PCBA line open circuit, short circuit and electronic components of the welding test. ICT test is more accurate, clear instructions, the use of a wider range.

3. FCT test

FCT test can test the environment, current, voltage, pressure and other parameters of PCBA, the test is more comprehensive and can ensure that the various parameters of PCBA board meet the requirements of customers. Before the test, you can understand which point customers need to pay special attention to, and can focus on the attention during the test.

4. Aging test

Aging test through the PCBA board for uninterrupted continuous power, simulating the user's use of the scene, to detect some defects that are not easy to find, as well as to test the service life of the product, can ensure the stability of the product.

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Zhejiang NeoDen Technology Co., Ltd. has been manufacturing and exporting various small pick and place machines since 2010. Taking advantage of our own rich experienced R&D, well trained production, NeoDen wins great reputation from the world wide customers.

We believe that great people and partners make NeoDen a great company and that our commitment to Innovation, Diversity and Sustainability ensures that SMT automation is accessible to every hobbyist everywhere.

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