SMT assembly Processing/Patch Processing Basic Process Elements
The basic process elements of smt assembly processing / patch processing:
Silk Screen (or Dispensing) –> Mounting –> (Curing) –> Reflow Soldering –> Cleaning –> Testing –> Rework
Silk screen: Its function is to print solder paste or patch glue on the pad of PCB to prepare for soldering of components. The equipment used is a screen printing machine (screen printer), located at the forefront of the SMT production line.
Dispensing: It is a glue that drops the glue to a fixed position on the PCB. Its main function is to fix the components to the PCB. The equipment used is a dispenser located at the forefront of the SMT line or behind the inspection equipment.
Mounting: Its function is to accurately mount surface-mounted components to a fixed position on the PCB. The equipment used is a placement machine located behind the screen printing machine in the SMT production line.
Curing: Its function is to melt the patch glue, so that the surface-mount components and the PCB board are firmly bonded together. The equipment used is a curing oven located behind the placement machine in the SMT line.
Reflow soldering: The function is to melt the solder paste, so that the surface-mount components and the PCB board are firmly bonded together. The equipment used is a reflow oven located behind the placement machine in the SMT line.
Cleaning: The function is to remove the welding residue (such as flux) which is harmful to the human body on the assembled PCB. The equipment used is a washing machine, the position can be fixed, it can be online or not.