Reflow soldering techniques produce a background
Due to the continuous miniaturization of PCBs for electronic products, sheet-like components have emerged and the traditional welding methods can no longer meet the needs. At first, the reflow soldering process was used only for the assembly of hybrid integrated circuits. Most of the components for assembly and soldering were chip capacitors, chip inductors, mounted transistors and diodes. With the development of SMT technology, the reflow soldering technology and equipment as a part of the mounting technology have also been developed. The application of SMC and SMD is becoming more and more widespread. Almost all electronic products have been applied.
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