What Are The Advantages Of The Joint Use Of SMT SPI Machine And AOI Equipment? - Industrial News

In recent years, with the SMT mounted zero device precision is more and more high volume is more and more small, SMT product inspection technology is constantly updated, SMT AOI automatic optical inspection equipment is more upgraded, become more efficient amazing! Therefore, with the development of the PCBA industry, the stronger the function, the smaller the volume, AOI more and more shows its important position. 0402 below the components of the visual inspection can not meet the requirements, you can use AOI check, and then visually inspect the false alarms.

Small components of the PCB circuit board, ICT has no place under the needle, this time with a 3D raster scanning solder paste detector can be fully automated to truly realize the measurement data and product lines, stencils and printing parameters associated with automatic judgment, automatic generation of reports.

1. According to statistics, the introduction of SMT SPI machine can effectively reduce the original finished PCB failure rate of more than 85%. Rework, scrap cost significantly reduced by more than 90%, the factory product quality significantly improved.

2. SMT SPI and AOI machine joint use, through the SMT production line real-time feedback and optimization, can make the production quality more stable, greatly shortening the introduction of new products must experience the instability of the trial production stage, the corresponding cost savings.

3. SMT AOI machine can significantly reduce the rate of misjudgment on the solder, thereby improving the through rate, effectively saving human error correction of human labor, time costs, SPI by means of 3D inspection to effectively make up for the shortcomings of the traditional inspection methods.

4. Part of the PCB components such as BGA, CSP, PLCC chips, etc., due to their own characteristics brought about by the light blocking, reflow soldering, AOI can not be detected. And SPI through the process control, minimize the bad situation of these devices after the furnace.

5. With the trend of increasing precision and lead-free soldering of finished electronic products, SMD components are becoming more and more miniature, so the quality of solder paste printing is becoming more and more important, SPI can effectively ensure that the good quality of the solder paste printing, significantly reducing the possibility of finished product defective rate appears.

6. As a means of product quality process control, quality hazards can be detected in a timely manner before reflow soldering, so there is virtually no rework costs and the possibility of scrap, effective cost savings.

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