Common design problems with BGA
1. BGA bottom hole is untreated.
There are holes in the BGA pad, and the ball is lost with solder in the welding process.
PCB production did not implement welding resistance process, resulting in solder and solder ball loss through the hole adjacent to the solder pad, resulting in missing solder ball.
2. BGA resistance film poorly designed PCB pads with through holes will lead to solder loss:
microhole, blind hole or plug hole process must be adopted in high density assembly to avoid solder loss.
3. BGA pad design.
BGA pad lead wire should not exceed 50% of the diameter of the pad, the lead wire of the power pad should not be less than 0.1mm, and then can be thickened.
In order to prevent the deformation of the pad, the solder resistance window should not be greater than 0.05mm.
4. The size of the welding pad is not standardized, too large or too small.
5. BGA pads vary in size and solder joints are irregular and round in size.
6. The distance between the BGA frame line and the edge of the component body is too close. All parts of the component should be within the range of the marking line.
The distance between the frame line and the edge of the component package body should be more than 1/2 of the welding end size of the component.