The development of SMT chip processing has brought an innovation to the entire electronics industry, especially in the current environment, people are pursuing miniaturization of electronic products. The perforated insert components used in the past cannot be reduced, resulting in an increase in the size of the entire electronic product. At this stage, SMT patch processing has brought us a new innovation. Below are about the problems that need to be paid attention to in the processing of batch processing.
First: the joint standard for the development of electrostatic discharge control programs. Includes the design, establishment, implementation, and maintenance necessary for electrostatic discharge control procedures. Provide guidance on the handling and protection of electrostatic discharge sensitive periods based on the historical experience of certain military and commercial organizations.
Second: the semi-aqueous cleaning manual after welding. Includes all aspects of semi-aqueous cleaning, including chemical, production residues, equipment, processes, process control, and environmental and safety considerations.
Third: Through Hole Solder Joint Evaluation Desktop Reference Manual. A detailed description of the components, the walls of the holes, and the coverage of the soldered surfaces, in addition to the standard requirements, in addition to computer-generated 3D graphics. Covers tin filling, contact angles, soldering, vertical filling, pad coverage, and numerous solder joint defects.
Fourth: template design guide. Provides guidelines for the design and manufacture of solder paste and surface mount adhesive coated stencils. i also discusses stencil design using surface mount technology and introduces kiln with via or flip chip components. Technology, including overprinting, double printing and staged template design.
Fifth: Water cleaning manual after welding. Describe the cost of manufacturing residues, the type and nature of water-based detergents, the process of cleaning water, equipment and processes, quality control, environmental control and employee safety, and the determination and determination of cleanliness.